Qualcomm Fastconnect 6900 vulnerabilities, page 2
617 vulnerabilities
Known vulnerabilities in Qualcomm Fastconnect 6900, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21428qualcomm, inc.snapdragon+69
EPSS score0.26%
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request from the AP to establish a TSpec session.CVE-2025-21468qualcomm, inc.snapdragon+146EPSS score0.11%
Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer.CVE-2025-21461qualcomm, inc.snapdragon+24EPSS score0.09%
Memory corruption when programming registers through virtual CDM.CVE-2025-21477qualcomm, inc.snapdragon+87EPSS score0.22%
Transient DOS while processing CCCH data when NW sends data with invalid length.CVE-2025-21446qualcomm, inc.snapdragon+235EPSS score0.24%
Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests.CVE-2025-21474qualcomm, inc.snapdragon+45EPSS score0.09%
Memory corruption while processing commands from A2dp sink command queue.CVE-2025-21432qualcomm, inc.snapdragon+239EPSS score0.09%
Memory corruption while retrieving the CBOR data from TA.CVE-2025-21481qualcomm, inc.snapdragon+249EPSS score0.07%
Memory corruption while performing private key encryption in trusted application.CVE-2025-21435qualcomm, inc.snapdragon+149EPSS score0.26%
Transient DOS may occur while parsing extended IE in beacon.CVE-2025-21439qualcomm, inc.snapdragon+25EPSS score0.11%
Memory corruption may occur while reading board data via IOCTL call when the WLAN driver copies the content to the provided output buffer.CVE-2025-21459qualcomm, inc.snapdragon+123EPSS score0.34%
Transient DOS while parsing per STA profile in ML IE.CVE-2025-21462qualcomm, inc.snapdragon+13EPSS score0.11%
Memory corruption while processing an IOCTL request, when buffer significantly exceeds the command argument limit.CVE-2025-21483qualcomm, inc.snapdragon+225EPSS score0.42%
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.CVE-2025-21485qualcomm, inc.snapdragon+29EPSS score0.08%
Memory corruption while processing INIT and multimode invoke IOCTL calls on FastRPC.CVE-2025-21421qualcomm, inc.snapdragon+45EPSS score0.11%
Memory corruption while processing escape code in API.CVE-2025-21456qualcomm, inc.snapdragon+64EPSS score0.09%
Memory corruption while processing IOCTL command when multiple threads are called to map/unmap buffer concurrently.CVE-2025-21438qualcomm, inc.snapdragon+43EPSS score0.11%
Memory corruption while IOCTL call is invoked from user-space to read board data.CVE-2025-21482qualcomm, inc.snapdragon+287EPSS score0.09%
Cryptographic issue while performing RSA PKCS padding decoding.CVE-2025-21449qualcomm, inc.snapdragon+178EPSS score0.24%
Transient DOS may occur while processing malformed length field in SSID IEs.CVE-2025-21434qualcomm, inc.snapdragon+121EPSS score0.26%
Transient DOS may occur while parsing EHT operation IE or EHT capability IE.