Qualcomm Fwa Gen 3 Ultra vulnerabilities

36 vulnerabilities

Known vulnerabilities in Qualcomm Fwa Gen 3 Ultra, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.

5.5CVE-2025-59609qualcomm, inc.snapdragon+186
EPSS score
0.09%
Information Disclosure when processing advertisement frames with malformed MBSSID elements of insufficient length.
7.8CVE-2025-59604qualcomm, inc.snapdragon+258
EPSS score
0.07%
Memory Corruption when running a memory copy operation due to invalid writes caused by a null pointer.
7.8CVE-2025-47376qualcomm, inc.snapdragon+165
EPSS score
0.07%
Memory Corruption when concurrent access to shared buffer occurs during IOCTL calls.
7.8CVE-2025-47379qualcomm, inc.snapdragon+173
EPSS score
0.07%
Memory Corruption when concurrent access to shared buffer occurs due to improper synchronization between assignment and deallocation of buffer resources.
7.8CVE-2025-47375qualcomm, inc.snapdragon+164
EPSS score
0.07%
Memory corruption while handling different IOCTL calls from the user-space simultaneously.
7.8CVE-2025-47377qualcomm, inc.snapdragon+120
EPSS score
0.07%
Memory Corruption when accessing a buffer after it has been freed while processing IOCTL calls.
8.8CVE-2025-47392qualcomm, inc.snapdragon+148
EPSS score
0.17%
Memory corruption when decoding corrupted satellite data files with invalid signature offsets.
7.5CVE-2025-47401qualcomm, inc.snapdragon+241
EPSS score
0.22%
Transient DOS when processing target power rate tables during channel configuration.
7.8CVE-2025-47389qualcomm, inc.snapdragon+176
EPSS score
0.10%
Memory corruption when buffer copy operation fails due to integer overflow during attestation report generation.
6.5CVE-2025-47402qualcomm, inc.snapdragon+94
EPSS score
0.16%
Transient DOS when processing a received frame with an excessively large authentication information element.
7.8CVE-2025-47404qualcomm, inc.snapdragon+183
EPSS score
0.07%
Memory corruption when dynamically changing the size of a previously allocated buffer while its contents are being modified.
7.8CVE-2025-47373qualcomm, inc.snapdragon+184
EPSS score
0.07%
Memory Corruption when accessing buffers with invalid length during TA invocation.
7.8CVE-2025-47386qualcomm, inc.snapdragon+165
EPSS score
0.07%
Memory Corruption while invoking IOCTL calls when concurrent access to shared buffer occurs.
7.5CVE-2025-47403qualcomm, inc.snapdragon+254
EPSS score
0.22%
Transient DOS when processing a malformed Fast Transition response frame with an invalid header structure during wireless roaming.
7.2CVE-2025-47383qualcomm, inc.snapdragon+200
EPSS score
0.14%
Weak configuration may lead to cryptographic issue when a VoWiFi call is triggered from UE.
6.5CVE-2025-47371qualcomm, inc.snapdragon+122
EPSS score
0.10%
Transient DOS when an LTE RLC packet with invalid TB is received by UE.
7.6CVE-2026-21381qualcomm, inc.snapdragon+102
EPSS score
0.15%
Transient DOS when receiving a service data frame with excessive length during device matching over a neighborhood awareness network protocol connection.
7.6CVE-2026-21367qualcomm, inc.snapdragon+149
EPSS score
0.20%
Transient DOS when processing nonstandard FILS Discovery Frames with out-of-range action sizes during initial scans.
7.5CVE-2026-25275qualcomm, inc.snapdragon+369
EPSS score
0.19%
Transient DOS when processing authentication frames with invalid FILS information element header lengths.
7.1CVE-2026-25302qualcomm, inc.snapdragon+285
EPSS score
0.06%
Cryptographic Issue when processing non-ELF partitions, authentication and signature checks are bypassed, allowing unsigned or corrupted images to be mounted and processed.