Qualcomm Immersive Home 316 Platform vulnerabilities, page 2

89 vulnerabilities

Known vulnerabilities in Qualcomm Immersive Home 316 Platform, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.

7.5CVE-2024-21457qualcomm, inc.snapdragon+111
EPSS score
0.21%
INformation disclosure while handling Multi-link IE in beacon frame.
7.5CVE-2024-21459qualcomm, inc.snapdragon+175
EPSS score
0.26%
Information disclosure while handling beacon or probe response frame in STA.
7.5CVE-2024-21467qualcomm, inc.snapdragon+129
EPSS score
0.26%
Information disclosure while handling beacon probe frame during scan entry generation in client side.
9.1CVE-2024-38408qualcomm, inc.snapdragon+229
EPSS score
0.14%
Cryptographic issue when a controller receives an LMP start encryption command under unexpected conditions.
7.5CVE-2024-33026qualcomm, inc.snapdragon+164
EPSS score
0.28%
Transient DOS while parsing probe response and assoc response frame when received frame length is less than max size of timestamp.
7.5CVE-2024-33011qualcomm, inc.snapdragon+247
EPSS score
0.28%
Transient DOS while parsing the MBSSID IE from the beacons, when the MBSSID IE length is zero.
9.8CVE-2024-33066qualcomm, inc.snapdragon+71
EPSS score
0.60%
Memory corruption while redirecting log file to any file location with any file name.
7.5CVE-2024-33012qualcomm, inc.snapdragon+247
EPSS score
0.28%
Transient DOS while parsing the multiple MBSSID IEs from the beacon, when the tag length is non-zero value but with end of beacon.
7.5CVE-2024-33010qualcomm, inc.snapdragon+246
EPSS score
0.28%
Transient DOS while parsing fragments of MBSSID IE from beacon frame.
7.5CVE-2024-33019qualcomm, inc.snapdragon+148
EPSS score
0.28%
Transient DOS while parsing the received TID-to-link mapping action frame.
8.2CVE-2024-33073qualcomm, inc.snapdragon+158
EPSS score
0.35%
Information disclosure while parsing the BSS parameter change count or MLD capabilities fields of the ML IE.
7.5CVE-2024-33025qualcomm, inc.snapdragon+167
EPSS score
0.28%
Transient DOS while parsing the BSS parameter change count or MLD capabilities fields of the ML IE.
8.4CVE-2024-33056qualcomm, inc.snapdragon+323
EPSS score
0.10%
Memory corruption when allocating and accessing an entry in an SMEM partition continuously.
7.5CVE-2024-33018qualcomm, inc.snapdragon+150
EPSS score
0.33%
Transient DOS while parsing the received TID-to-link mapping element of the TID-to-link mapping action frame.
7.5CVE-2024-33014qualcomm, inc.snapdragon+319
EPSS score
0.32%
Transient DOS while parsing ESP IE from beacon/probe response frame.
7.5CVE-2024-33024qualcomm, inc.snapdragon+179
EPSS score
0.28%
Transient DOS while parsing the ML IE when a beacon with length field inside the common info of ML IE greater than the ML IE length.
7.5CVE-2024-33015qualcomm, inc.snapdragon+192
EPSS score
0.28%
Transient DOS while parsing SCAN RNR IE when bytes received from AP is such that the size of the last param of IE is less than neighbor report.
7.5CVE-2024-33049qualcomm, inc.snapdragon+131
EPSS score
0.32%
Transient DOS while parsing noninheritance IE of Extension element when length of IE is 2 of beacon frame.
7.5CVE-2024-33013qualcomm, inc.snapdragon+169
EPSS score
0.28%
Transient DOS when driver accesses the ML IE memory and offset value is incremented beyond ML IE length.
7.8CVE-2024-23368qualcomm, inc.snapdragon+341
EPSS score
0.10%
Memory corruption when allocating and accessing an entry in an SMEM partition.