Qualcomm Qca6678Aq vulnerabilities
260 vulnerabilities
Known vulnerabilities in Qualcomm Qca6678Aq, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21487qualcomm, inc.snapdragon+225
EPSS score0.26%
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.CVE-2025-21484qualcomm, inc.snapdragon+173EPSS score0.26%
Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments from RTP packet.CVE-2025-21429qualcomm, inc.snapdragon+182EPSS score0.26%
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.CVE-2025-21433qualcomm, inc.snapdragon+268EPSS score0.09%
Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.CVE-2025-21427qualcomm, inc.snapdragon+172EPSS score0.24%
Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.CVE-2025-21424qualcomm, inc.snapdragon+233EPSS score0.12%
Memory corruption while calling the NPU driver APIs concurrently.CVE-2025-21464qualcomm, inc.snapdragon+340EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21450qualcomm, inc.snapdragon+104EPSS score0.32%
Cryptographic issue occurs due to use of insecure connection method while downloading.CVE-2025-21430qualcomm, inc.snapdragon+223EPSS score0.26%
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.CVE-2025-21448qualcomm, inc.snapdragon+267EPSS score0.26%
Transient DOS may occur while parsing SSID in action frames.CVE-2025-21446qualcomm, inc.snapdragon+235EPSS score0.24%
Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests.CVE-2025-21432qualcomm, inc.snapdragon+239EPSS score0.09%
Memory corruption while retrieving the CBOR data from TA.CVE-2025-21481qualcomm, inc.snapdragon+249EPSS score0.07%
Memory corruption while performing private key encryption in trusted application.CVE-2025-21435qualcomm, inc.snapdragon+149EPSS score0.26%
Transient DOS may occur while parsing extended IE in beacon.CVE-2025-21459qualcomm, inc.snapdragon+123EPSS score0.34%
Transient DOS while parsing per STA profile in ML IE.CVE-2025-21483qualcomm, inc.snapdragon+225EPSS score0.42%
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.CVE-2025-21434qualcomm, inc.snapdragon+121EPSS score0.26%
Transient DOS may occur while parsing EHT operation IE or EHT capability IE.CVE-2025-21465qualcomm, inc.snapdragon+347EPSS score0.09%
Information disclosure while processing the hash segment in an MBN file.CVE-2025-21422qualcomm, inc.snapdragon+215EPSS score0.10%
Cryptographic issue while processing crypto API calls, missing checks may lead to corrupted key usage or IV reuses.CVE-2025-21453qualcomm, inc.snapdragon+259EPSS score0.11%
Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur.