Qualcomm Qcc710 vulnerabilities
310 vulnerabilities
Known vulnerabilities in Qualcomm Qcc710, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2021-35129qualcomm, inc.snapdragon compute, snapdragon connectivity, snapdragon consumer electronics connectivity, snapdragon industrial iot, snapdragon mobile, snapdragon wired infrastructure and networking+45
EPSS score0.16%
Memory corruption in BT controller due to improper length check while processing vendor specific commands in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and NetworkingCVE-2025-21433qualcomm, inc.snapdragon+268EPSS score0.09%
Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.CVE-2025-21424qualcomm, inc.snapdragon+233EPSS score0.12%
Memory corruption while calling the NPU driver APIs concurrently.CVE-2025-21464qualcomm, inc.snapdragon+340EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21450qualcomm, inc.snapdragon+104EPSS score0.32%
Cryptographic issue occurs due to use of insecure connection method while downloading.CVE-2025-21457qualcomm, inc.snapdragon+15EPSS score0.09%
Information disclosure while opening a fastrpc session when domain is not sanitized.CVE-2025-21430qualcomm, inc.snapdragon+223EPSS score0.26%
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.CVE-2025-21448qualcomm, inc.snapdragon+267EPSS score0.26%
Transient DOS may occur while parsing SSID in action frames.CVE-2025-21477qualcomm, inc.snapdragon+87EPSS score0.22%
Transient DOS while processing CCCH data when NW sends data with invalid length.CVE-2025-21446qualcomm, inc.snapdragon+235EPSS score0.24%
Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests.CVE-2025-21432qualcomm, inc.snapdragon+239EPSS score0.09%
Memory corruption while retrieving the CBOR data from TA.CVE-2025-21481qualcomm, inc.snapdragon+249EPSS score0.07%
Memory corruption while performing private key encryption in trusted application.CVE-2025-21435qualcomm, inc.snapdragon+149EPSS score0.26%
Transient DOS may occur while parsing extended IE in beacon.CVE-2025-21459qualcomm, inc.snapdragon+123EPSS score0.34%
Transient DOS while parsing per STA profile in ML IE.CVE-2025-21456qualcomm, inc.snapdragon+64EPSS score0.09%
Memory corruption while processing IOCTL command when multiple threads are called to map/unmap buffer concurrently.CVE-2025-21434qualcomm, inc.snapdragon+121EPSS score0.26%
Transient DOS may occur while parsing EHT operation IE or EHT capability IE.CVE-2025-21465qualcomm, inc.snapdragon+347EPSS score0.09%
Information disclosure while processing the hash segment in an MBN file.CVE-2025-21422qualcomm, inc.snapdragon+215EPSS score0.10%
Cryptographic issue while processing crypto API calls, missing checks may lead to corrupted key usage or IV reuses.CVE-2025-21453qualcomm, inc.snapdragon+259EPSS score0.11%
Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur.CVE-2025-21463qualcomm, inc.snapdragon+210EPSS score0.23%
Transient DOS while processing the EHT operation IE in the received beacon frame.