Qualcomm Qdx1010 vulnerabilities, page 2

116 vulnerabilities

Known vulnerabilities in Qualcomm Qdx1010, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.

7.8CVE-2025-27070qualcomm, inc.snapdragon+174
EPSS score
0.06%
Memory corruption while performing encryption and decryption commands.
7.8CVE-2025-27061qualcomm, inc.snapdragon+337
EPSS score
0.10%
Memory corruption whhile handling the subsystem failure memory during the parsing of video packets received from the video firmware.
7.8CVE-2025-27042qualcomm, inc.snapdragon+337
EPSS score
0.09%
Memory corruption while processing video packets received from video firmware.
7.8CVE-2025-27054qualcomm, inc.snapdragon+297
EPSS score
0.09%
Memory corruption while processing a malformed license file during reboot.
7.8CVE-2025-27043qualcomm, inc.snapdragon+203
EPSS score
0.10%
Memory corruption while processing manipulated payload in video firmware.
7.8CVE-2025-27053qualcomm, inc.snapdragon+317
EPSS score
0.09%
Memory corruption during PlayReady APP usecase while processing TA commands.
7.8CVE-2024-21465qualcomm, inc.snapdragon+257
EPSS score
0.10%
Memory corruption while processing key blob passed by the user.
8.4CVE-2024-21461qualcomm, inc.snapdragon+311
EPSS score
0.10%
Memory corruption while performing finish HMAC operation when context is freed by keymaster.
7.8CVE-2024-21469qualcomm, inc.snapdragon+222
EPSS score
0.10%
Memory corruption when an invoke call and a TEE call are bound for the same trusted application.
7.8CVE-2024-21475qualcomm, inc.snapdragon+229
EPSS score
0.11%
Memory corruption when the payload received from firmware is not as per the expected protocol size.
7.1CVE-2024-21462qualcomm, inc.snapdragon+309
EPSS score
0.09%
Transient DOS while loading the TA ELF file.
8.4CVE-2024-21481qualcomm, inc.snapdragon+165
EPSS score
0.11%
Memory corruption when preparing a shared memory notification for a memparcel in Resource Manager.
7.1CVE-2024-43065qualcomm, inc.snapdragon+164
EPSS score
0.11%
Cryptographic issues while generating an asymmetric key pair for RKP use cases.
6.5CVE-2024-43056qualcomm, inc.snapdragon+187
EPSS score
0.11%
Transient DOS during hypervisor virtual I/O operation in a virtual machine.
5.5CVE-2024-43046qualcomm, inc.snapdragon+308
EPSS score
0.11%
There may be information disclosure during memory re-allocation in TZ Secure OS.
5.5CVE-2024-43051qualcomm, inc.snapdragon+237
EPSS score
0.11%
Information disclosure while deriving keys for a session for any Widevine use case.
7.8CVE-2024-53010qualcomm, inc.snapdragon+191
EPSS score
0.08%
Memory corruption may occur while attaching VM when the HLOS retains access to VM.
7.8CVE-2024-53009qualcomm, inc.snapdragon+185
EPSS score
0.10%
Memory corruption while operating the mailbox in Automotive.
7.8CVE-2024-53023qualcomm, inc.snapdragon+102
EPSS score
0.12%
Memory corruption may occur while accessing a variable during extended back to back tests.
7.8CVE-2024-38419qualcomm, inc.snapdragon+146
EPSS score
0.10%
Memory corruption while invoking IOCTL calls from the use-space for HGSL memory node.