Qualcomm Qep8111 vulnerabilities, page 3
152 vulnerabilities
Known vulnerabilities in Qualcomm Qep8111, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-27070qualcomm, inc.snapdragon+174
EPSS score0.06%
Memory corruption while performing encryption and decryption commands.CVE-2025-27061qualcomm, inc.snapdragon+337EPSS score0.10%
Memory corruption whhile handling the subsystem failure memory during the parsing of video packets received from the video firmware.CVE-2025-27034qualcomm, inc.snapdragon+111EPSS score0.41%
Memory corruption while selecting the PLMN from SOR failed list.CVE-2025-27042qualcomm, inc.snapdragon+337EPSS score0.09%
Memory corruption while processing video packets received from video firmware.CVE-2025-27054qualcomm, inc.snapdragon+297EPSS score0.09%
Memory corruption while processing a malformed license file during reboot.CVE-2025-27052qualcomm, inc.snapdragon+154EPSS score0.10%
Memory corruption while processing data packets in diag received from Unix clients.CVE-2025-27043qualcomm, inc.snapdragon+203EPSS score0.10%
Memory corruption while processing manipulated payload in video firmware.CVE-2025-27053qualcomm, inc.snapdragon+317EPSS score0.09%
Memory corruption during PlayReady APP usecase while processing TA commands.CVE-2025-27066qualcomm, inc.snapdragon+370EPSS score0.28%
Transient DOS while processing an ANQP message.CVE-2024-21465qualcomm, inc.snapdragon+257EPSS score0.10%
Memory corruption while processing key blob passed by the user.CVE-2024-21480qualcomm, inc.snapdragon+112EPSS score0.29%
Memory corruption while playing audio file having large-sized input buffer.CVE-2024-21461qualcomm, inc.snapdragon+311EPSS score0.10%
Memory corruption while performing finish HMAC operation when context is freed by keymaster.CVE-2024-21463qualcomm, inc.snapdragon+105EPSS score0.29%
Memory corruption while processing Codec2 during v13k decoder pitch synthesis.CVE-2024-21469qualcomm, inc.snapdragon+222EPSS score0.10%
Memory corruption when an invoke call and a TEE call are bound for the same trusted application.CVE-2024-21475qualcomm, inc.snapdragon+229EPSS score0.11%
Memory corruption when the payload received from firmware is not as per the expected protocol size.CVE-2024-21462qualcomm, inc.snapdragon+309EPSS score0.09%
Transient DOS while loading the TA ELF file.CVE-2024-21481qualcomm, inc.snapdragon+165EPSS score0.11%
Memory corruption when preparing a shared memory notification for a memparcel in Resource Manager.CVE-2024-43065qualcomm, inc.snapdragon+164EPSS score0.11%
Cryptographic issues while generating an asymmetric key pair for RKP use cases.CVE-2024-43056qualcomm, inc.snapdragon+187EPSS score0.11%
Transient DOS during hypervisor virtual I/O operation in a virtual machine.CVE-2024-43046qualcomm, inc.snapdragon+308EPSS score0.11%
There may be information disclosure during memory re-allocation in TZ Secure OS.