Qualcomm Qrb5165N vulnerabilities, page 4

330 vulnerabilities

Known vulnerabilities in Qualcomm Qrb5165N, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.

5.5CVE-2021-35071qualcomm, inc.snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon industrial iot, snapdragon mobile, snapdragon wearables, snapdragon wired infrastructure and networking+171
EPSS score
0.14%
Possible buffer over read due to lack of size validation while copying data from DBR buffer to RX buffer and can lead to Denial of Service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
7.8CVE-2025-21467qualcomm, inc.snapdragon+103
EPSS score
0.11%
Memory corruption while reading the FW response from the shared queue.
6.2CVE-2025-21433qualcomm, inc.snapdragon+268
EPSS score
0.09%
Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.
7.8CVE-2025-21424qualcomm, inc.snapdragon+233
EPSS score
0.12%
Memory corruption while calling the NPU driver APIs concurrently.
6.5CVE-2025-21464qualcomm, inc.snapdragon+340
EPSS score
0.09%
Information disclosure while reading data from an image using specified offset and size parameters.
7.5CVE-2025-21430qualcomm, inc.snapdragon+223
EPSS score
0.26%
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.
7.5CVE-2025-21448qualcomm, inc.snapdragon+267
EPSS score
0.26%
Transient DOS may occur while parsing SSID in action frames.
7.8CVE-2025-21468qualcomm, inc.snapdragon+146
EPSS score
0.11%
Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer.
7.8CVE-2025-21432qualcomm, inc.snapdragon+239
EPSS score
0.09%
Memory corruption while retrieving the CBOR data from TA.
7.8CVE-2025-21481qualcomm, inc.snapdragon+249
EPSS score
0.07%
Memory corruption while performing private key encryption in trusted application.
7.5CVE-2025-21459qualcomm, inc.snapdragon+123
EPSS score
0.34%
Transient DOS while parsing per STA profile in ML IE.
6.5CVE-2025-21465qualcomm, inc.snapdragon+347
EPSS score
0.09%
Information disclosure while processing the hash segment in an MBN file.
7.5CVE-2025-21463qualcomm, inc.snapdragon+210
EPSS score
0.23%
Transient DOS while processing the EHT operation IE in the received beacon frame.
5.5CVE-2025-59609qualcomm, inc.snapdragon+186
EPSS score
0.09%
Information Disclosure when processing advertisement frames with malformed MBSSID elements of insufficient length.
6.4CVE-2025-59610qualcomm, inc.snapdragon+229
EPSS score
0.06%
Memory Corruption when processing IOCTL requests with mismatched API versions due to concurrent modification of user-space buffer.
7.8CVE-2025-47376qualcomm, inc.snapdragon+165
EPSS score
0.07%
Memory Corruption when concurrent access to shared buffer occurs during IOCTL calls.
7.5CVE-2025-47318qualcomm, inc.snapdragon+202
EPSS score
0.21%
Transient DOS while parsing the EPTM test control message to get the test pattern.
7.8CVE-2025-47379qualcomm, inc.snapdragon+173
EPSS score
0.07%
Memory Corruption when concurrent access to shared buffer occurs due to improper synchronization between assignment and deallocation of buffer resources.
6.7CVE-2025-47334qualcomm, inc.snapdragon+144
EPSS score
0.08%
Memory corruption while processing shared command buffer packet between camera userspace and kernel.
7.8CVE-2025-47375qualcomm, inc.snapdragon+164
EPSS score
0.07%
Memory corruption while handling different IOCTL calls from the user-space simultaneously.