Qualcomm Robotics Rb3 Platform vulnerabilities
74 vulnerabilities
Known vulnerabilities in Qualcomm Robotics Rb3 Platform, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21487qualcomm, inc.snapdragon+225
EPSS score0.26%
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.CVE-2025-21484qualcomm, inc.snapdragon+173EPSS score0.26%
Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments from RTP packet.CVE-2025-21464qualcomm, inc.snapdragon+340EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21430qualcomm, inc.snapdragon+223EPSS score0.26%
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.CVE-2025-21483qualcomm, inc.snapdragon+225EPSS score0.42%
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.CVE-2025-21482qualcomm, inc.snapdragon+287EPSS score0.09%
Cryptographic issue while performing RSA PKCS padding decoding.CVE-2025-21465qualcomm, inc.snapdragon+347EPSS score0.09%
Information disclosure while processing the hash segment in an MBN file.CVE-2025-27032qualcomm, inc.snapdragon+191EPSS score0.08%
memory corruption while loading a PIL authenticated VM, when authenticated VM image is loaded without maintaining cache coherency.CVE-2025-27053qualcomm, inc.snapdragon+317EPSS score0.09%
Memory corruption during PlayReady APP usecase while processing TA commands.CVE-2025-27066qualcomm, inc.snapdragon+370EPSS score0.28%
Transient DOS while processing an ANQP message.CVE-2022-40523qualcomm, inc.snapdragon+185EPSS score0.11%
Information disclosure in Kernel due to indirect branch misprediction.CVE-2022-40507qualcomm, inc.snapdragon+242EPSS score1.31%
Memory corruption due to double free in Core while mapping HLOS address to the list.CVE-2022-40529qualcomm, inc.snapdragon+196EPSS score0.10%
Memory corruption due to improper access control in kernel while processing a mapping request from root process.CVE-2022-22076qualcomm, inc.snapdragon+348EPSS score0.11%
information disclosure due to cryptographic issue in Core during RPMB read request.CVE-2022-33264qualcomm, inc.snapdragon+241EPSS score0.11%
Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message.CVE-2022-33307qualcomm, inc.snapdragon+110EPSS score0.12%
Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed.CVE-2024-21465qualcomm, inc.snapdragon+257EPSS score0.10%
Memory corruption while processing key blob passed by the user.CVE-2024-21461qualcomm, inc.snapdragon+311EPSS score0.10%
Memory corruption while performing finish HMAC operation when context is freed by keymaster.CVE-2024-21469qualcomm, inc.snapdragon+222EPSS score0.10%
Memory corruption when an invoke call and a TEE call are bound for the same trusted application.CVE-2024-21462qualcomm, inc.snapdragon+309EPSS score0.09%
Transient DOS while loading the TA ELF file.