Qualcomm Sa8295P vulnerabilities
483 vulnerabilities
Known vulnerabilities in Qualcomm Sa8295P, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2021-30334qualcomm, inc.snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon consumer iot, snapdragon industrial iot, snapdragon voice & music, snapdragon wearables+131
EPSS score0.16%
Possible use after free due to lack of null check of DRM file status after file structure is freed in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon WearablesCVE-2021-35126qualcomm, inc.snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon industrial iot, snapdragon mobile+26EPSS score0.16%
Memory corruption in DSP service due to improper validation of input parameters in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon MobileCVE-2021-35112qualcomm, inc.snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon consumer iot, snapdragon industrial iot, snapdragon mobile, snapdragon voice & music, snapdragon wearables+107EPSS score0.14%
A user with user level permission can access graphics protected region due to improper access control in register configuration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon WearablesCVE-2021-35104qualcommapq8009w_firmware+175EPSS score0.83%
Possible buffer overflow due to improper parsing of headers while playing the FLAC audio clip in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and NetworkingCVE-2021-35130qualcomm, inc.snapdragon auto, snapdragon consumer iot, snapdragon industrial iot, snapdragon mobile, snapdragon wearables+57EPSS score0.16%
Memory corruption in graphics support layer due to use after free condition in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon WearablesCVE-2021-35071qualcomm, inc.snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon industrial iot, snapdragon mobile, snapdragon wearables, snapdragon wired infrastructure and networking+171EPSS score0.14%
Possible buffer over read due to lack of size validation while copying data from DBR buffer to RX buffer and can lead to Denial of Service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and NetworkingCVE-2025-21467qualcomm, inc.snapdragon+103EPSS score0.11%
Memory corruption while reading the FW response from the shared queue.CVE-2025-21425qualcomm, inc.snapdragon+33EPSS score0.09%
Memory corruption may occur due top improper access control in HAB process.CVE-2025-21487qualcomm, inc.snapdragon+225EPSS score0.26%
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.CVE-2025-21484qualcomm, inc.snapdragon+173EPSS score0.26%
Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments from RTP packet.CVE-2025-21444qualcomm, inc.snapdragon+27EPSS score0.10%
Memory corruption while copying the result to the transmission queue in EMAC.CVE-2025-21433qualcomm, inc.snapdragon+268EPSS score0.09%
Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.CVE-2025-21427qualcomm, inc.snapdragon+172EPSS score0.24%
Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.CVE-2025-21424qualcomm, inc.snapdragon+233EPSS score0.12%
Memory corruption while calling the NPU driver APIs concurrently.CVE-2025-21464qualcomm, inc.snapdragon+340EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21431qualcomm, inc.snapdragon+36EPSS score0.08%
Information disclosure may be there when a guest VM is connected.CVE-2025-21454qualcomm, inc.snapdragon+185EPSS score0.24%
Transient DOS while processing received beacon frame.CVE-2025-21430qualcomm, inc.snapdragon+223EPSS score0.26%
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.CVE-2025-21448qualcomm, inc.snapdragon+267EPSS score0.26%
Transient DOS may occur while parsing SSID in action frames.CVE-2025-21468qualcomm, inc.snapdragon+146EPSS score0.11%
Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer.