Qualcomm Sa9000P vulnerabilities, page 2
412 vulnerabilities
Known vulnerabilities in Qualcomm Sa9000P, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21424qualcomm, inc.snapdragon+233
EPSS score0.12%
Memory corruption while calling the NPU driver APIs concurrently.CVE-2025-21464qualcomm, inc.snapdragon+340EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21431qualcomm, inc.snapdragon+36EPSS score0.08%
Information disclosure may be there when a guest VM is connected.CVE-2025-21454qualcomm, inc.snapdragon+185EPSS score0.24%
Transient DOS while processing received beacon frame.CVE-2025-21430qualcomm, inc.snapdragon+223EPSS score0.26%
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.CVE-2025-21448qualcomm, inc.snapdragon+267EPSS score0.26%
Transient DOS may occur while parsing SSID in action frames.CVE-2025-21468qualcomm, inc.snapdragon+146EPSS score0.11%
Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer.CVE-2025-21446qualcomm, inc.snapdragon+235EPSS score0.24%
Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests.CVE-2025-21442qualcomm, inc.snapdragon+26EPSS score0.11%
Memory corruption while transmitting packet mapping information with invalid header payload size.CVE-2025-21432qualcomm, inc.snapdragon+239EPSS score0.09%
Memory corruption while retrieving the CBOR data from TA.CVE-2025-21481qualcomm, inc.snapdragon+249EPSS score0.07%
Memory corruption while performing private key encryption in trusted application.CVE-2025-21460qualcomm, inc.snapdragon+36EPSS score0.11%
Memory corruption while processing a message, when the buffer is controlled by a Guest VM, the value can be changed continuously.CVE-2025-21459qualcomm, inc.snapdragon+123EPSS score0.34%
Transient DOS while parsing per STA profile in ML IE.CVE-2025-21443qualcomm, inc.snapdragon+36EPSS score0.11%
Memory corruption while processing message content in eAVB.CVE-2025-21483qualcomm, inc.snapdragon+225EPSS score0.42%
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.CVE-2025-21456qualcomm, inc.snapdragon+64EPSS score0.09%
Memory corruption while processing IOCTL command when multiple threads are called to map/unmap buffer concurrently.CVE-2025-21445qualcomm, inc.snapdragon+27EPSS score0.10%
Memory corruption while copying the result to the transmission queue which is shared between the virtual machine and the host.CVE-2025-21482qualcomm, inc.snapdragon+287EPSS score0.09%
Cryptographic issue while performing RSA PKCS padding decoding.CVE-2025-21449qualcomm, inc.snapdragon+178EPSS score0.24%
Transient DOS may occur while processing malformed length field in SSID IEs.CVE-2025-21434qualcomm, inc.snapdragon+121EPSS score0.26%
Transient DOS may occur while parsing EHT operation IE or EHT capability IE.