Qualcomm Sd670 vulnerabilities, page 4
374 vulnerabilities
Known vulnerabilities in Qualcomm Sd670, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21487qualcomm, inc.snapdragon+225
EPSS score0.26%
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.CVE-2025-21429qualcomm, inc.snapdragon+182EPSS score0.26%
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.CVE-2025-21433qualcomm, inc.snapdragon+268EPSS score0.09%
Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.CVE-2025-21427qualcomm, inc.snapdragon+172EPSS score0.24%
Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.CVE-2025-21464qualcomm, inc.snapdragon+340EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21454qualcomm, inc.snapdragon+185EPSS score0.24%
Transient DOS while processing received beacon frame.CVE-2025-21432qualcomm, inc.snapdragon+239EPSS score0.09%
Memory corruption while retrieving the CBOR data from TA.CVE-2025-21481qualcomm, inc.snapdragon+249EPSS score0.07%
Memory corruption while performing private key encryption in trusted application.CVE-2025-21483qualcomm, inc.snapdragon+225EPSS score0.42%
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.CVE-2025-21482qualcomm, inc.snapdragon+287EPSS score0.09%
Cryptographic issue while performing RSA PKCS padding decoding.CVE-2025-21449qualcomm, inc.snapdragon+178EPSS score0.24%
Transient DOS may occur while processing malformed length field in SSID IEs.CVE-2025-21465qualcomm, inc.snapdragon+347EPSS score0.09%
Information disclosure while processing the hash segment in an MBN file.CVE-2025-21422qualcomm, inc.snapdragon+215EPSS score0.10%
Cryptographic issue while processing crypto API calls, missing checks may lead to corrupted key usage or IV reuses.CVE-2025-21453qualcomm, inc.snapdragon+259EPSS score0.11%
Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur.CVE-2025-21488qualcomm, inc.snapdragon+106EPSS score0.27%
Information disclosure while decoding this RTP packet headers received by UE from the network when the padding bit is set.CVE-2025-27032qualcomm, inc.snapdragon+191EPSS score0.08%
memory corruption while loading a PIL authenticated VM, when authenticated VM image is loaded without maintaining cache coherency.CVE-2025-27054qualcomm, inc.snapdragon+297EPSS score0.09%
Memory corruption while processing a malformed license file during reboot.CVE-2025-27053qualcomm, inc.snapdragon+317EPSS score0.09%
Memory corruption during PlayReady APP usecase while processing TA commands.CVE-2025-27066qualcomm, inc.snapdragon+370EPSS score0.28%
Transient DOS while processing an ANQP message.CVE-2020-11200qualcomm, inc.snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon consumer iot, snapdragon industrial iot, snapdragon mobile+330EPSS score0.79%
Buffer over-read while parsing RPS due to lack of check of input validation on values received from user side. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile