Qualcomm Sd 8 Gen1 5G vulnerabilities, page 4

429 vulnerabilities

Known vulnerabilities in Qualcomm Sd 8 Gen1 5G, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.

7.8CVE-2021-35103qualcomm, inc.snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon industrial iot, snapdragon mobile, snapdragon wearables, snapdragon wired infrastructure and networking+149
EPSS score
0.20%
Possible out of bound write due to improper validation of number of timer values received from firmware while syncing timers in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
8.4CVE-2021-35074qualcomm, inc.snapdragon auto, snapdragon connectivity, snapdragon industrial iot, snapdragon mobile+41
EPSS score
0.19%
Possible integer overflow due to improper fragment datatype while calculating number of fragments in a request message in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
7.8CVE-2021-35106qualcomm, inc.snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon consumer iot, snapdragon industrial iot, snapdragon mobile, snapdragon voice & music, snapdragon wearables+112
EPSS score
0.19%
Possible out of bound read due to improper length calculation of WMI message. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
7.8CVE-2021-35087qualcomm, inc.snapdragon industrial iot, snapdragon mobile+41
EPSS score
0.61%
Possible null pointer access due to improper validation of system information message to be processed in Snapdragon Industrial IOT, Snapdragon Mobile
7.1CVE-2021-35085qualcomm, inc.snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon industrial iot, snapdragon mobile+70
EPSS score
0.14%
Possible buffer overflow due to lack of buffer length check during management frame Rx handling in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
5.5CVE-2021-35071qualcomm, inc.snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon industrial iot, snapdragon mobile, snapdragon wearables, snapdragon wired infrastructure and networking+171
EPSS score
0.14%
Possible buffer over read due to lack of size validation while copying data from DBR buffer to RX buffer and can lead to Denial of Service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
8.2CVE-2025-21487qualcomm, inc.snapdragon+225
EPSS score
0.26%
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.
6.2CVE-2025-21433qualcomm, inc.snapdragon+268
EPSS score
0.09%
Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.
8.2CVE-2025-21427qualcomm, inc.snapdragon+172
EPSS score
0.24%
Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.
6.5CVE-2025-21464qualcomm, inc.snapdragon+340
EPSS score
0.09%
Information disclosure while reading data from an image using specified offset and size parameters.
9.1CVE-2025-21450qualcomm, inc.snapdragon+104
EPSS score
0.32%
Cryptographic issue occurs due to use of insecure connection method while downloading.
7.5CVE-2025-21454qualcomm, inc.snapdragon+185
EPSS score
0.24%
Transient DOS while processing received beacon frame.
7.5CVE-2025-21430qualcomm, inc.snapdragon+223
EPSS score
0.26%
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.
7.5CVE-2025-21448qualcomm, inc.snapdragon+267
EPSS score
0.26%
Transient DOS may occur while parsing SSID in action frames.
7.8CVE-2025-21468qualcomm, inc.snapdragon+146
EPSS score
0.11%
Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer.
7.5CVE-2025-21446qualcomm, inc.snapdragon+235
EPSS score
0.24%
Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests.
7.8CVE-2025-21432qualcomm, inc.snapdragon+239
EPSS score
0.09%
Memory corruption while retrieving the CBOR data from TA.
7.8CVE-2025-21481qualcomm, inc.snapdragon+249
EPSS score
0.07%
Memory corruption while performing private key encryption in trusted application.
9.8CVE-2025-21483qualcomm, inc.snapdragon+225
EPSS score
0.42%
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
7.1CVE-2025-21482qualcomm, inc.snapdragon+287
EPSS score
0.09%
Cryptographic issue while performing RSA PKCS padding decoding.