Qualcomm Sd 8Cx Gen3 vulnerabilities, page 3
59 vulnerabilities
Known vulnerabilities in Qualcomm Sd 8Cx Gen3, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2022-33285qualcomm, inc.snapdragon+278
EPSS score0.39%
Transient DOS due to buffer over-read in WLAN while parsing WLAN CSA action frames.CVE-2022-33237qualcommaqt1000_firmware+237EPSS score0.42%
Transient DOS due to buffer over-read in WLAN firmware while processing PPE threshold. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and NetworkingCVE-2022-33277qualcomm, inc.snapdragon+243EPSS score0.12%
Memory corruption in modem due to buffer copy without checking size of input while receiving WMI command.CVE-2022-33269qualcomm, inc.snapdragon+101EPSS score0.12%
Memory corruption due to integer overflow or wraparound in Core while DDR memory assignment.CVE-2022-33276qualcomm, inc.snapdragon+134EPSS score0.12%
Memory corruption due to buffer copy without checking size of input in modem while receiving WMI_REQUEST_STATS_CMDID command.CVE-2022-33306qualcomm, inc.snapdragon+131EPSS score0.42%
Transient DOS due to buffer over-read in WLAN while processing an incoming management frame with incorrectly filled IEs.CVE-2022-33238qualcommapq8009_firmware+283EPSS score0.44%
Transient DOS due to loop with unreachable exit condition in WLAN while processing an incoming FTM frames. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and NetworkingCVE-2022-33278qualcomm, inc.snapdragon+123EPSS score0.12%
Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity.CVE-2022-33286qualcomm, inc.snapdragon+281EPSS score0.39%
Transient DOS due to buffer over-read in WLAN while processing 802.11 management frames.CVE-2022-33271qualcomm, inc.snapdragon+245EPSS score0.38%
Information disclosure due to buffer over-read in WLAN while parsing NMF frame.CVE-2022-33231qualcomm, inc.snapdragon+219EPSS score0.08%
Memory corruption due to double free in core while initializing the encryption key.CVE-2022-33235qualcommapq8009_firmware+245EPSS score0.40%
Information disclosure due to buffer over-read in WLAN firmware while parsing security context info attributes. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and NetworkingCVE-2022-33242qualcomm, inc.snapdragon+157EPSS score0.14%
Memory corruption due to improper authentication in Qualcomm IPC while loading unsigned lib in audio PD.CVE-2022-33252qualcomm, inc.snapdragon+161EPSS score0.25%
Information disclosure due to buffer over-read in WLAN while handling IBSS beacons frame.CVE-2023-21652qualcomm, inc.snapdragon+120EPSS score0.10%
Cryptographic issue in HLOS as derived keys used to encrypt/decrypt information is present on stack after use.CVE-2023-21664qualcomm, inc.snapdragon+137EPSS score0.12%
Memory Corruption in Core Platform while printing the response buffer in log.CVE-2023-21626qualcomm, inc.snapdragon+185EPSS score0.11%
Cryptographic issue in HLOS due to improper authentication while performing key velocity checks using more than one key.CVE-2023-21651qualcomm, inc.snapdragon+140EPSS score0.12%
Memory Corruption in Core due to incorrect type conversion or cast in secure_io_read/write function in TEE.CVE-2023-21662qualcomm, inc.snapdragon+136EPSS score0.12%
Memory corruption in Core Platform while printing the response buffer in log.