Qualcomm Sg8275P vulnerabilities
216 vulnerabilities
Known vulnerabilities in Qualcomm Sg8275P, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21433qualcomm, inc.snapdragon+268
EPSS score0.09%
Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.CVE-2025-21424qualcomm, inc.snapdragon+233EPSS score0.12%
Memory corruption while calling the NPU driver APIs concurrently.CVE-2025-21464qualcomm, inc.snapdragon+340EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21450qualcomm, inc.snapdragon+104EPSS score0.32%
Cryptographic issue occurs due to use of insecure connection method while downloading.CVE-2025-21454qualcomm, inc.snapdragon+185EPSS score0.24%
Transient DOS while processing received beacon frame.CVE-2025-21430qualcomm, inc.snapdragon+223EPSS score0.26%
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.CVE-2025-21448qualcomm, inc.snapdragon+267EPSS score0.26%
Transient DOS may occur while parsing SSID in action frames.CVE-2025-21468qualcomm, inc.snapdragon+146EPSS score0.11%
Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer.CVE-2025-21477qualcomm, inc.snapdragon+87EPSS score0.22%
Transient DOS while processing CCCH data when NW sends data with invalid length.CVE-2025-21446qualcomm, inc.snapdragon+235EPSS score0.24%
Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests.CVE-2025-21476qualcomm, inc.snapdragon+42EPSS score0.09%
Memory corruption when passing parameters to the Trusted Virtual Machine during the handshake.CVE-2025-21432qualcomm, inc.snapdragon+239EPSS score0.09%
Memory corruption while retrieving the CBOR data from TA.CVE-2025-21459qualcomm, inc.snapdragon+123EPSS score0.34%
Transient DOS while parsing per STA profile in ML IE.CVE-2025-21482qualcomm, inc.snapdragon+287EPSS score0.09%
Cryptographic issue while performing RSA PKCS padding decoding.CVE-2025-21449qualcomm, inc.snapdragon+178EPSS score0.24%
Transient DOS may occur while processing malformed length field in SSID IEs.CVE-2025-21434qualcomm, inc.snapdragon+121EPSS score0.26%
Transient DOS may occur while parsing EHT operation IE or EHT capability IE.CVE-2025-21465qualcomm, inc.snapdragon+347EPSS score0.09%
Information disclosure while processing the hash segment in an MBN file.CVE-2025-21422qualcomm, inc.snapdragon+215EPSS score0.10%
Cryptographic issue while processing crypto API calls, missing checks may lead to corrupted key usage or IV reuses.CVE-2025-21453qualcomm, inc.snapdragon+259EPSS score0.11%
Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur.CVE-2025-21463qualcomm, inc.snapdragon+210EPSS score0.23%
Transient DOS while processing the EHT operation IE in the received beacon frame.