Qualcomm Sm4375 vulnerabilities, page 3
84 vulnerabilities
Known vulnerabilities in Qualcomm Sm4375, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2022-33214qualcomm, inc.snapdragon auto, snapdragon compute, snapdragon consumer iot, snapdragon industrial iot, snapdragon mobile, snapdragon wearables+102
EPSS score0.09%
Memory corruption in display due to time-of-check time-of-use of metadata reserved size in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon WearablesCVE-2022-33298qualcomm, inc.snapdragon+77EPSS score0.11%
Memory corruption due to use after free in Modem while modem initialization.CVE-2022-33289qualcomm, inc.snapdragon+226EPSS score0.19%
Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card.CVE-2022-33302qualcomm, inc.snapdragon+225EPSS score0.12%
Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length.CVE-2022-33251qualcomm, inc.snapdragon+74EPSS score0.38%
Transient DOS due to reachable assertion in Modem because of invalid network configuration.CVE-2022-33270qualcomm, inc.snapdragon+42EPSS score0.28%
Transient DOS due to time-of-check time-of-use race condition in Modem while processing RRC Reconfiguration message.CVE-2022-33238qualcommapq8009_firmware+283EPSS score0.44%
Transient DOS due to loop with unreachable exit condition in WLAN while processing an incoming FTM frames. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and NetworkingCVE-2022-33286qualcomm, inc.snapdragon+281EPSS score0.39%
Transient DOS due to buffer over-read in WLAN while processing 802.11 management frames.CVE-2022-33234qualcomm, inc.snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon consumer iot, snapdragon industrial iot, snapdragon mobile, snapdragon wearables+110EPSS score0.33%
Memory corruption in video due to configuration weakness. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon WearablesCVE-2022-33231qualcomm, inc.snapdragon+219EPSS score0.08%
Memory corruption due to double free in core while initializing the encryption key.CVE-2022-33235qualcommapq8009_firmware+245EPSS score0.40%
Information disclosure due to buffer over-read in WLAN firmware while parsing security context info attributes. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and NetworkingCVE-2023-21652qualcomm, inc.snapdragon+120EPSS score0.10%
Cryptographic issue in HLOS as derived keys used to encrypt/decrypt information is present on stack after use.CVE-2023-21649qualcomm, inc.snapdragon+65EPSS score0.11%
Memory corruption in WLAN while running doDriverCmd for an unspecific command.CVE-2023-21628qualcomm, inc.snapdragon+283EPSS score0.12%
Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command.CVE-2023-21636qualcomm, inc.snapdragon+51EPSS score0.11%
Memory Corruption due to improper validation of array index in Linux while updating adn record.CVE-2023-21644qualcomm, inc.snapdragon+51EPSS score0.11%
Memory corruption in RIL due to Integer Overflow while triggering qcril_uim_request_apdu request.CVE-2023-21626qualcomm, inc.snapdragon+185EPSS score0.11%
Cryptographic issue in HLOS due to improper authentication while performing key velocity checks using more than one key.CVE-2023-21657qualcomm, inc.snapdragon+126EPSS score0.12%
Memoru corruption in Audio when ADSP sends input during record use case.CVE-2023-21659qualcomm, inc.snapdragon+270EPSS score0.38%
Transient DOS in WLAN Firmware while processing frames with missing header fields.CVE-2023-21651qualcomm, inc.snapdragon+140EPSS score0.12%
Memory Corruption in Core due to incorrect type conversion or cast in secure_io_read/write function in TEE.