Qualcomm Sm6370 vulnerabilities
72 vulnerabilities
Known vulnerabilities in Qualcomm Sm6370, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21487qualcomm, inc.snapdragon+225
EPSS score0.26%
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.CVE-2025-21484qualcomm, inc.snapdragon+173EPSS score0.26%
Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments from RTP packet.CVE-2025-21429qualcomm, inc.snapdragon+182EPSS score0.26%
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.CVE-2025-21433qualcomm, inc.snapdragon+268EPSS score0.09%
Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.CVE-2025-21427qualcomm, inc.snapdragon+172EPSS score0.24%
Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.CVE-2025-21424qualcomm, inc.snapdragon+233EPSS score0.12%
Memory corruption while calling the NPU driver APIs concurrently.CVE-2025-21464qualcomm, inc.snapdragon+340EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21450qualcomm, inc.snapdragon+104EPSS score0.32%
Cryptographic issue occurs due to use of insecure connection method while downloading.CVE-2025-21454qualcomm, inc.snapdragon+185EPSS score0.24%
Transient DOS while processing received beacon frame.CVE-2025-21452qualcomm, inc.snapdragon+80EPSS score0.21%
Transient DOS while processing a random-access response (RAR) with an invalid PDU length on LTE network.CVE-2025-21468qualcomm, inc.snapdragon+146EPSS score0.11%
Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer.CVE-2025-21432qualcomm, inc.snapdragon+239EPSS score0.09%
Memory corruption while retrieving the CBOR data from TA.CVE-2025-21481qualcomm, inc.snapdragon+249EPSS score0.07%
Memory corruption while performing private key encryption in trusted application.CVE-2025-21483qualcomm, inc.snapdragon+225EPSS score0.42%
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.CVE-2025-21482qualcomm, inc.snapdragon+287EPSS score0.09%
Cryptographic issue while performing RSA PKCS padding decoding.CVE-2025-21449qualcomm, inc.snapdragon+178EPSS score0.24%
Transient DOS may occur while processing malformed length field in SSID IEs.CVE-2025-21465qualcomm, inc.snapdragon+347EPSS score0.09%
Information disclosure while processing the hash segment in an MBN file.CVE-2025-21453qualcomm, inc.snapdragon+259EPSS score0.11%
Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur.CVE-2025-21488qualcomm, inc.snapdragon+106EPSS score0.27%
Information disclosure while decoding this RTP packet headers received by UE from the network when the padding bit is set.CVE-2025-27061qualcomm, inc.snapdragon+337EPSS score0.10%
Memory corruption whhile handling the subsystem failure memory during the parsing of video packets received from the video firmware.