Qualcomm Sm7325 vulnerabilities, page 4

105 vulnerabilities

Known vulnerabilities in Qualcomm Sm7325, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.

9.1CVE-2020-11301qualcommapq8009_firmware+266
EPSS score
11.11%
Improper authentication of un-encrypted plaintext Wi-Fi frames in an encrypted network can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
7.1CVE-2022-40523qualcomm, inc.snapdragon+185
EPSS score
0.11%
Information disclosure in Kernel due to indirect branch misprediction.
8.4CVE-2022-40507qualcomm, inc.snapdragon+242
EPSS score
1.31%
Memory corruption due to double free in Core while mapping HLOS address to the list.
7.5CVE-2022-40521qualcomm, inc.snapdragon+242
EPSS score
0.35%
Transient DOS due to improper authorization in Modem
8.4CVE-2022-40532qualcomm, inc.snapdragon+353
EPSS score
0.12%
Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target.
7.5CVE-2022-40504qualcomm, inc.snapdragon+189
EPSS score
0.38%
Transient DOS due to reachable assertion in Modem when UE received Downlink Data Indication message from the network.
6.2CVE-2022-40533qualcomm, inc.snapdragon+110
EPSS score
0.10%
Transient DOS due to untrusted Pointer Dereference in core while sending USB QMI request.
8.2CVE-2022-40503qualcomm, inc.snapdragon+185
EPSS score
0.41%
Information disclosure due to buffer over-read in Bluetooth Host while A2DP streaming.
7.5CVE-2022-40536qualcomm, inc.snapdragon+81
EPSS score
0.40%
Transient DOS due to improper authentication in modem while receiving plain TLB OTA request message from network.
7.8CVE-2022-40529qualcomm, inc.snapdragon+196
EPSS score
0.10%
Memory corruption due to improper access control in kernel while processing a mapping request from root process.
7.1CVE-2022-22076qualcomm, inc.snapdragon+348
EPSS score
0.11%
information disclosure due to cryptographic issue in Core during RPMB read request.
7.5CVE-2022-22060qualcomm, inc.snapdragon+74
EPSS score
0.38%
Assertion occurs while processing Reconfiguration message due to improper validation
8.4CVE-2022-22080qualcomm, inc.snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon consumer iot, snapdragon industrial iot, snapdragon mobile, snapdragon voice & music+112
EPSS score
0.12%
Improper validation of backend id in PCM routing process can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
7.5CVE-2022-34144qualcomm, inc.snapdragon+68
EPSS score
0.38%
Transient DOS due to reachable assertion in Modem during OSI decode scheduling.
7.5CVE-2022-33305qualcomm, inc.snapdragon+81
EPSS score
0.38%
Transient DOS due to NULL pointer dereference in Modem while sending invalid messages in DCCH.
9.3CVE-2022-33288qualcomm, inc.snapdragon+128
EPSS score
0.12%
Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information.
7.9CVE-2022-33264qualcomm, inc.snapdragon+241
EPSS score
0.11%
Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message.
6.8CVE-2022-33289qualcomm, inc.snapdragon+226
EPSS score
0.19%
Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card.
7.8CVE-2022-33302qualcomm, inc.snapdragon+225
EPSS score
0.12%
Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length.
7.5CVE-2022-33251qualcomm, inc.snapdragon+74
EPSS score
0.38%
Transient DOS due to reachable assertion in Modem because of invalid network configuration.