Qualcomm Snapdragon 636 Mobile Platform vulnerabilities
47 vulnerabilities
Known vulnerabilities in Qualcomm Snapdragon 636 Mobile Platform, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21487qualcomm, inc.snapdragon+225
EPSS score0.26%
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.CVE-2025-21483qualcomm, inc.snapdragon+225EPSS score0.42%
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.CVE-2022-40507qualcomm, inc.snapdragon+242EPSS score1.31%
Memory corruption due to double free in Core while mapping HLOS address to the list.CVE-2022-40521qualcomm, inc.snapdragon+242EPSS score0.35%
Transient DOS due to improper authorization in ModemCVE-2022-40532qualcomm, inc.snapdragon+353EPSS score0.12%
Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target.CVE-2022-40504qualcomm, inc.snapdragon+189EPSS score0.38%
Transient DOS due to reachable assertion in Modem when UE received Downlink Data Indication message from the network.CVE-2022-22076qualcomm, inc.snapdragon+348EPSS score0.11%
information disclosure due to cryptographic issue in Core during RPMB read request.CVE-2022-33264qualcomm, inc.snapdragon+241EPSS score0.11%
Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message.CVE-2022-33289qualcomm, inc.snapdragon+226EPSS score0.19%
Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card.CVE-2022-33302qualcomm, inc.snapdragon+225EPSS score0.12%
Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length.CVE-2022-33231qualcomm, inc.snapdragon+219EPSS score0.08%
Memory corruption due to double free in core while initializing the encryption key.CVE-2024-21461qualcomm, inc.snapdragon+311EPSS score0.10%
Memory corruption while performing finish HMAC operation when context is freed by keymaster.CVE-2024-53026qualcomm, inc.snapdragon+232EPSS score0.30%
Information disclosure when an invalid RTCP packet is received during a VoLTE/VoWiFi IMS call.CVE-2024-53021qualcomm, inc.snapdragon+223EPSS score0.24%
Information disclosure may occur while processing goodbye RTCP packet from network.CVE-2024-53020qualcomm, inc.snapdragon+232EPSS score0.24%
Information disclosure may occur while decoding the RTP packet with invalid header extension from network.CVE-2024-38422qualcomm, inc.snapdragon+263EPSS score0.10%
Memory corruption while processing voice packet with arbitrary data received from ADSP.CVE-2024-38423qualcomm, inc.snapdragon+203EPSS score0.10%
Memory corruption while processing GPU page table switch.CVE-2024-33043qualcomm, inc.snapdragon+197EPSS score0.09%
Transient DOS while handling PS event when Program Service name length offset value is set to 255.CVE-2024-33056qualcomm, inc.snapdragon+323EPSS score0.10%
Memory corruption when allocating and accessing an entry in an SMEM partition continuously.CVE-2024-33014qualcomm, inc.snapdragon+319EPSS score0.32%
Transient DOS while parsing ESP IE from beacon/probe response frame.