Qualcomm Snapdragon 670 Mobile Platform vulnerabilities
80 vulnerabilities
Known vulnerabilities in Qualcomm Snapdragon 670 Mobile Platform, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21487qualcomm, inc.snapdragon+225
EPSS score0.26%
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.CVE-2025-21429qualcomm, inc.snapdragon+182EPSS score0.26%
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.CVE-2025-21464qualcomm, inc.snapdragon+340EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21481qualcomm, inc.snapdragon+249EPSS score0.07%
Memory corruption while performing private key encryption in trusted application.CVE-2025-21483qualcomm, inc.snapdragon+225EPSS score0.42%
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.CVE-2025-21465qualcomm, inc.snapdragon+347EPSS score0.09%
Information disclosure while processing the hash segment in an MBN file.CVE-2025-21488qualcomm, inc.snapdragon+106EPSS score0.27%
Information disclosure while decoding this RTP packet headers received by UE from the network when the padding bit is set.CVE-2025-27032qualcomm, inc.snapdragon+191EPSS score0.08%
memory corruption while loading a PIL authenticated VM, when authenticated VM image is loaded without maintaining cache coherency.CVE-2025-27054qualcomm, inc.snapdragon+297EPSS score0.09%
Memory corruption while processing a malformed license file during reboot.CVE-2025-27053qualcomm, inc.snapdragon+317EPSS score0.09%
Memory corruption during PlayReady APP usecase while processing TA commands.CVE-2025-27066qualcomm, inc.snapdragon+370EPSS score0.28%
Transient DOS while processing an ANQP message.CVE-2024-21465qualcomm, inc.snapdragon+257EPSS score0.10%
Memory corruption while processing key blob passed by the user.CVE-2024-21461qualcomm, inc.snapdragon+311EPSS score0.10%
Memory corruption while performing finish HMAC operation when context is freed by keymaster.CVE-2024-21469qualcomm, inc.snapdragon+222EPSS score0.10%
Memory corruption when an invoke call and a TEE call are bound for the same trusted application.CVE-2024-21462qualcomm, inc.snapdragon+309EPSS score0.09%
Transient DOS while loading the TA ELF file.CVE-2024-21481qualcomm, inc.snapdragon+165EPSS score0.11%
Memory corruption when preparing a shared memory notification for a memparcel in Resource Manager.CVE-2024-43046qualcomm, inc.snapdragon+308EPSS score0.11%
There may be information disclosure during memory re-allocation in TZ Secure OS.CVE-2024-53026qualcomm, inc.snapdragon+232EPSS score0.30%
Information disclosure when an invalid RTCP packet is received during a VoLTE/VoWiFi IMS call.CVE-2024-53010qualcomm, inc.snapdragon+191EPSS score0.08%
Memory corruption may occur while attaching VM when the HLOS retains access to VM.CVE-2024-53021qualcomm, inc.snapdragon+223EPSS score0.24%
Information disclosure may occur while processing goodbye RTCP packet from network.