Qualcomm Snapdragon 870 5G Mobile Platform vulnerabilities, page 4
104 vulnerabilities
Known vulnerabilities in Qualcomm Snapdragon 870 5G Mobile Platform, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2023-28572qualcomm, inc.snapdragon+54
EPSS score0.40%
Memory corruption in WLAN HOST while processing the WLAN scan descriptor list.CVE-2023-28549qualcomm, inc.snapdragon+220EPSS score0.12%
Memory corruption in WLAN HAL while parsing Rx buffer in processing TLV payload.CVE-2023-28586qualcomm, inc.snapdragon+307EPSS score0.14%
Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.CVE-2023-28553qualcomm, inc.snapdragon+142EPSS score0.14%
Information Disclosure in WLAN Host when processing WMI event command.CVE-2023-28556qualcomm, inc.snapdragon+220EPSS score0.12%
Cryptographic issue in HLOS during key management.CVE-2023-28588qualcomm, inc.snapdragon+208EPSS score0.52%
Transient DOS in Bluetooth Host while rfc slot allocation.CVE-2023-28570qualcomm, inc.snapdragon+83EPSS score0.14%
Memory corruption while processing audio effects.CVE-2023-28558qualcomm, inc.snapdragon+195EPSS score0.12%
Memory corruption in WLAN handler while processing PhyID in Tx status handler.CVE-2023-28587qualcomm, inc.snapdragon+184EPSS score0.16%
Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level.CVE-2023-28551qualcomm, inc.snapdragon+242EPSS score0.12%
Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments.CVE-2023-28585qualcomm, inc.snapdragon+275EPSS score0.14%
Memory corruption while loading an ELF segment in TEE Kernel.CVE-2023-28548qualcomm, inc.snapdragon+179EPSS score0.12%
Memory corruption in WLAN HAL while processing Tx/Rx commands from QDART.CVE-2023-28550qualcomm, inc.snapdragon+329EPSS score0.12%
Memory corruption in MPP performance while accessing DSM watermark using external memory address.CVE-2023-28546qualcomm, inc.snapdragon+274EPSS score0.11%
Memory Corruption in SPS Application while exporting public key in sorter TA.CVE-2023-33072qualcomm, inc.snapdragon+239EPSS score0.11%
Memory corruption in Core while processing control functions.CVE-2023-33092qualcomm, inc.snapdragon+90EPSS score0.16%
Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size.CVE-2023-33089qualcomm, inc.snapdragon+223EPSS score0.47%
Transient DOS when processing a NULL buffer while parsing WLAN vdev.CVE-2023-33110qualcomm, inc.snapdragon+118EPSS score0.08%
The session index variable in PCM host voice audio driver initialized before PCM open, accessed during event callback from ADSP and reset during PCM close may lead to race condition between event callback - PCM close and reset session index causing memory corruption.CVE-2023-33062qualcomm, inc.snapdragon+284EPSS score0.34%
Transient DOS in WLAN Firmware while parsing a BTM request.CVE-2023-33109qualcomm, inc.snapdragon+304EPSS score0.34%
Transient DOS while processing a WMI P2P listen start command (0xD00A) sent from host.