Qualcomm Snapdragon 8 Gen 1 Mobile Platform vulnerabilities

197 vulnerabilities

Known vulnerabilities in Qualcomm Snapdragon 8 Gen 1 Mobile Platform, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.

8.2CVE-2025-21487qualcomm, inc.snapdragon+225
EPSS score
0.26%
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.
8.2CVE-2025-21484qualcomm, inc.snapdragon+173
EPSS score
0.26%
Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments from RTP packet.
5.5CVE-2025-21472qualcomm, inc.snapdragon+12
EPSS score
0.09%
Information disclosure while capturing logs as eSE debug messages are logged.
7.5CVE-2025-21429qualcomm, inc.snapdragon+182
EPSS score
0.26%
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.
6.5CVE-2025-21464qualcomm, inc.snapdragon+340
EPSS score
0.09%
Information disclosure while reading data from an image using specified offset and size parameters.
7.5CVE-2025-21430qualcomm, inc.snapdragon+223
EPSS score
0.26%
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.
7.5CVE-2025-21448qualcomm, inc.snapdragon+267
EPSS score
0.26%
Transient DOS may occur while parsing SSID in action frames.
7.8CVE-2025-21461qualcomm, inc.snapdragon+24
EPSS score
0.09%
Memory corruption when programming registers through virtual CDM.
7.5CVE-2025-21477qualcomm, inc.snapdragon+87
EPSS score
0.22%
Transient DOS while processing CCCH data when NW sends data with invalid length.
7.8CVE-2025-21474qualcomm, inc.snapdragon+45
EPSS score
0.09%
Memory corruption while processing commands from A2dp sink command queue.
7.8CVE-2025-21481qualcomm, inc.snapdragon+249
EPSS score
0.07%
Memory corruption while performing private key encryption in trusted application.
9.8CVE-2025-21483qualcomm, inc.snapdragon+225
EPSS score
0.42%
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
7.8CVE-2025-21455qualcomm, inc.snapdragon+29
EPSS score
0.07%
Memory corruption while submitting blob data to kernel space though IOCTL.
6.5CVE-2025-21465qualcomm, inc.snapdragon+347
EPSS score
0.09%
Information disclosure while processing the hash segment in an MBN file.
7.8CVE-2025-21473qualcomm, inc.snapdragon+6
EPSS score
0.07%
Memory corruption when using Virtual cdm (Camera Data Mover) to write registers.
8.2CVE-2025-21488qualcomm, inc.snapdragon+106
EPSS score
0.27%
Information disclosure while decoding this RTP packet headers received by UE from the network when the padding bit is set.
7.8CVE-2025-59604qualcomm, inc.snapdragon+258
EPSS score
0.07%
Memory Corruption when running a memory copy operation due to invalid writes caused by a null pointer.
6.4CVE-2025-59610qualcomm, inc.snapdragon+229
EPSS score
0.06%
Memory Corruption when processing IOCTL requests with mismatched API versions due to concurrent modification of user-space buffer.
7.8CVE-2025-59605qualcomm, inc.snapdragon+134
EPSS score
0.07%
Memory Corruption when processing device identifier strings that exceed the expected maximum length.
7.5CVE-2025-47318qualcomm, inc.snapdragon+202
EPSS score
0.21%
Transient DOS while parsing the EPTM test control message to get the test pattern.