Qualcomm Snapdragon 8 Gen 2 Mobile Platform vulnerabilities, page 5
227 vulnerabilities
Known vulnerabilities in Qualcomm Snapdragon 8 Gen 2 Mobile Platform, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2024-33034qualcomm, inc.snapdragon+102
EPSS score0.10%
Memory corruption can occur if VBOs hold outdated or invalid GPU SMMU mappings, especially when the binding and reclaiming of memory buffers are performed at the same time.CVE-2024-33012qualcomm, inc.snapdragon+247EPSS score0.28%
Transient DOS while parsing the multiple MBSSID IEs from the beacon, when the tag length is non-zero value but with end of beacon.CVE-2024-33033qualcomm, inc.snapdragon+27EPSS score0.10%
Memory corruption while processing IOCTL calls to unmap the buffers.CVE-2024-33043qualcomm, inc.snapdragon+197EPSS score0.09%
Transient DOS while handling PS event when Program Service name length offset value is set to 255.CVE-2024-33010qualcomm, inc.snapdragon+246EPSS score0.28%
Transient DOS while parsing fragments of MBSSID IE from beacon frame.CVE-2024-33019qualcomm, inc.snapdragon+148EPSS score0.28%
Transient DOS while parsing the received TID-to-link mapping action frame.CVE-2024-33073qualcomm, inc.snapdragon+158EPSS score0.35%
Information disclosure while parsing the BSS parameter change count or MLD capabilities fields of the ML IE.CVE-2024-33016qualcomm, inc.snapdragon+331EPSS score0.15%
memory corruption when an invalid firehose patch command is invoked.CVE-2024-33022qualcomm, inc.snapdragon+123EPSS score0.10%
Memory corruption while allocating memory in HGSL driver.CVE-2024-33025qualcomm, inc.snapdragon+167EPSS score0.28%
Transient DOS while parsing the BSS parameter change count or MLD capabilities fields of the ML IE.CVE-2024-33023qualcomm, inc.snapdragon+151EPSS score0.11%
Memory corruption while creating a fence to wait on timeline events, and simultaneously signal timeline events.CVE-2024-33063qualcomm, inc.snapdragon+123EPSS score0.26%
Transient DOS while parsing the ML IE when a beacon with common info length of the ML IE greater than the ML IE inside which this element is present.CVE-2024-33056qualcomm, inc.snapdragon+323EPSS score0.10%
Memory corruption when allocating and accessing an entry in an SMEM partition continuously.CVE-2024-33028qualcomm, inc.snapdragon+136EPSS score0.11%
Memory corruption as fence object may still be accessed in timeline destruct after isync fence is released.CVE-2024-33021qualcomm, inc.snapdragon+136EPSS score0.10%
Memory corruption while processing IOCTL call to set metainfo.CVE-2024-33020qualcomm, inc.snapdragon+96EPSS score0.28%
Transient DOS while processing TID-to-link mapping IE elements.CVE-2024-33018qualcomm, inc.snapdragon+150EPSS score0.33%
Transient DOS while parsing the received TID-to-link mapping element of the TID-to-link mapping action frame.CVE-2024-33014qualcomm, inc.snapdragon+319EPSS score0.32%
Transient DOS while parsing ESP IE from beacon/probe response frame.CVE-2024-33024qualcomm, inc.snapdragon+179EPSS score0.28%
Transient DOS while parsing the ML IE when a beacon with length field inside the common info of ML IE greater than the ML IE length.CVE-2024-33015qualcomm, inc.snapdragon+192EPSS score0.28%
Transient DOS while parsing SCAN RNR IE when bytes received from AP is such that the size of the last param of IE is less than neighbor report.