Qualcomm Snapdragon 8 Gen 3 Mobile Platform vulnerabilities
176 vulnerabilities
Known vulnerabilities in Qualcomm Snapdragon 8 Gen 3 Mobile Platform, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21479qualcomm, inc.snapdragon+74KEV
EPSS score0.84%
Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands.CVE-2025-21487qualcomm, inc.snapdragon+225EPSS score0.26%
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.CVE-2025-21484qualcomm, inc.snapdragon+173EPSS score0.26%
Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments from RTP packet.CVE-2025-21429qualcomm, inc.snapdragon+182EPSS score0.26%
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.CVE-2025-21480qualcomm, inc.snapdragon+75KEVEPSS score0.46%
Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands.CVE-2025-21464qualcomm, inc.snapdragon+340EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21430qualcomm, inc.snapdragon+223EPSS score0.26%
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.CVE-2025-21448qualcomm, inc.snapdragon+267EPSS score0.26%
Transient DOS may occur while parsing SSID in action frames.CVE-2025-21436qualcomm, inc.snapdragon+25EPSS score0.11%
Memory corruption may occur while initiating two IOCTL calls simultaneously to create processes from two different threads.CVE-2025-21461qualcomm, inc.snapdragon+24EPSS score0.09%
Memory corruption when programming registers through virtual CDM.CVE-2025-21477qualcomm, inc.snapdragon+87EPSS score0.22%
Transient DOS while processing CCCH data when NW sends data with invalid length.CVE-2025-21481qualcomm, inc.snapdragon+249EPSS score0.07%
Memory corruption while performing private key encryption in trusted application.CVE-2025-21435qualcomm, inc.snapdragon+149EPSS score0.26%
Transient DOS may occur while parsing extended IE in beacon.CVE-2025-21483qualcomm, inc.snapdragon+225EPSS score0.42%
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.CVE-2025-21485qualcomm, inc.snapdragon+29EPSS score0.08%
Memory corruption while processing INIT and multimode invoke IOCTL calls on FastRPC.CVE-2025-21434qualcomm, inc.snapdragon+121EPSS score0.26%
Transient DOS may occur while parsing EHT operation IE or EHT capability IE.CVE-2025-21465qualcomm, inc.snapdragon+347EPSS score0.09%
Information disclosure while processing the hash segment in an MBN file.CVE-2025-21463qualcomm, inc.snapdragon+210EPSS score0.23%
Transient DOS while processing the EHT operation IE in the received beacon frame.CVE-2025-21488qualcomm, inc.snapdragon+106EPSS score0.27%
Information disclosure while decoding this RTP packet headers received by UE from the network when the padding bit is set.CVE-2025-59609qualcomm, inc.snapdragon+186EPSS score0.09%
Information Disclosure when processing advertisement frames with malformed MBSSID elements of insufficient length.