Qualcomm Snapdragon W5\+ Gen 1 Wearable Platform vulnerabilities
233 vulnerabilities
Known vulnerabilities in Qualcomm Snapdragon W5\+ Gen 1 Wearable Platform, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21487qualcomm, inc.snapdragon+225
EPSS score0.26%
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.CVE-2025-21484qualcomm, inc.snapdragon+173EPSS score0.26%
Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments from RTP packet.CVE-2025-21429qualcomm, inc.snapdragon+182EPSS score0.26%
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.CVE-2025-21464qualcomm, inc.snapdragon+340EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21430qualcomm, inc.snapdragon+223EPSS score0.26%
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.CVE-2025-21486qualcomm, inc.snapdragon+31EPSS score0.10%
Memory corruption during dynamic process creation call when client is only passing address and length of shell binary.CVE-2025-21436qualcomm, inc.snapdragon+25EPSS score0.11%
Memory corruption may occur while initiating two IOCTL calls simultaneously to create processes from two different threads.CVE-2025-21474qualcomm, inc.snapdragon+45EPSS score0.09%
Memory corruption while processing commands from A2dp sink command queue.CVE-2025-21481qualcomm, inc.snapdragon+249EPSS score0.07%
Memory corruption while performing private key encryption in trusted application.CVE-2025-21483qualcomm, inc.snapdragon+225EPSS score0.42%
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.CVE-2025-21485qualcomm, inc.snapdragon+29EPSS score0.08%
Memory corruption while processing INIT and multimode invoke IOCTL calls on FastRPC.CVE-2025-21456qualcomm, inc.snapdragon+64EPSS score0.09%
Memory corruption while processing IOCTL command when multiple threads are called to map/unmap buffer concurrently.CVE-2025-21482qualcomm, inc.snapdragon+287EPSS score0.09%
Cryptographic issue while performing RSA PKCS padding decoding.CVE-2025-21465qualcomm, inc.snapdragon+347EPSS score0.09%
Information disclosure while processing the hash segment in an MBN file.CVE-2025-21488qualcomm, inc.snapdragon+106EPSS score0.27%
Information disclosure while decoding this RTP packet headers received by UE from the network when the padding bit is set.CVE-2025-59600qualcomm, inc.snapdragon+162EPSS score0.08%
Memory Corruption when adding user-supplied data without checking available buffer space.CVE-2025-59604qualcomm, inc.snapdragon+258EPSS score0.07%
Memory Corruption when running a memory copy operation due to invalid writes caused by a null pointer.CVE-2025-59605qualcomm, inc.snapdragon+134EPSS score0.07%
Memory Corruption when processing device identifier strings that exceed the expected maximum length.CVE-2025-47376qualcomm, inc.snapdragon+165EPSS score0.07%
Memory Corruption when concurrent access to shared buffer occurs during IOCTL calls.CVE-2025-47396qualcomm, inc.snapdragon+45EPSS score0.08%
Memory corruption occurs when a secure application is launched on a device with insufficient memory.