Qualcomm Snapdragon W5\+ Gen 1 Wearable Platform vulnerabilities, page 4
233 vulnerabilities
Known vulnerabilities in Qualcomm Snapdragon W5\+ Gen 1 Wearable Platform, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2022-33296qualcomm, inc.snapdragon+114
EPSS score0.11%
Memory corruption due to integer overflow to buffer overflow in Modem while parsing Traffic Channel Neighbor List Update message.CVE-2022-33264qualcomm, inc.snapdragon+241EPSS score0.11%
Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message.CVE-2022-33230qualcomm, inc.snapdragon+44EPSS score0.11%
Memory corruption in FM Host due to buffer copy without checking the size of input in FM HostCVE-2022-33275qualcomm, inc.snapdragon+259EPSS score0.12%
Memory corruption due to improper validation of array index in WLAN HAL when received lm_itemNum is out of range.CVE-2022-33298qualcomm, inc.snapdragon+77EPSS score0.11%
Memory corruption due to use after free in Modem while modem initialization.CVE-2022-33289qualcomm, inc.snapdragon+226EPSS score0.19%
Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card.CVE-2022-33224qualcomm, inc.snapdragon+46EPSS score0.11%
Memory corruption in core due to buffer copy without check9ing the size of input while processing ioctl queries.CVE-2022-33302qualcomm, inc.snapdragon+225EPSS score0.12%
Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length.CVE-2022-33301qualcomm, inc.snapdragon+16EPSS score0.11%
Memory corruption due to incorrect type conversion or cast in audio while using audio playback/capture when crafted address is sent from AGM IPC to AGM.CVE-2022-33231qualcomm, inc.snapdragon+219EPSS score0.08%
Memory corruption due to double free in core while initializing the encryption key.CVE-2024-21465qualcomm, inc.snapdragon+257EPSS score0.10%
Memory corruption while processing key blob passed by the user.CVE-2024-21461qualcomm, inc.snapdragon+311EPSS score0.10%
Memory corruption while performing finish HMAC operation when context is freed by keymaster.CVE-2024-21479qualcomm, inc.snapdragon+94EPSS score0.32%
Transient DOS during music playback of ALAC content.CVE-2024-21459qualcomm, inc.snapdragon+175EPSS score0.26%
Information disclosure while handling beacon or probe response frame in STA.CVE-2024-21462qualcomm, inc.snapdragon+309EPSS score0.09%
Transient DOS while loading the TA ELF file.CVE-2024-21467qualcomm, inc.snapdragon+129EPSS score0.26%
Information disclosure while handling beacon probe frame during scan entry generation in client side.CVE-2024-43067qualcomm, inc.snapdragon+58EPSS score0.09%
Memory corruption occurs during the copying of read data from the EEPROM because the IO configuration is exposed as shared memory.CVE-2024-43066qualcomm, inc.snapdragon+98EPSS score0.11%
Memory corruption while handling file descriptor during listener registration/de-registration.CVE-2024-53016qualcomm, inc.snapdragon+34EPSS score0.08%
Memory corruption while processing I2C settings in Camera driver.CVE-2024-53026qualcomm, inc.snapdragon+232EPSS score0.30%
Information disclosure when an invalid RTCP packet is received during a VoLTE/VoWiFi IMS call.