Qualcomm Snapdragon Wear 1300 Platform vulnerabilities
45 vulnerabilities
Known vulnerabilities in Qualcomm Snapdragon Wear 1300 Platform, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21464qualcomm, inc.snapdragon+340
EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21482qualcomm, inc.snapdragon+287EPSS score0.09%
Cryptographic issue while performing RSA PKCS padding decoding.CVE-2025-21465qualcomm, inc.snapdragon+347EPSS score0.09%
Information disclosure while processing the hash segment in an MBN file.CVE-2025-27054qualcomm, inc.snapdragon+297EPSS score0.09%
Memory corruption while processing a malformed license file during reboot.CVE-2025-27053qualcomm, inc.snapdragon+317EPSS score0.09%
Memory corruption during PlayReady APP usecase while processing TA commands.CVE-2022-40523qualcomm, inc.snapdragon+185EPSS score0.11%
Information disclosure in Kernel due to indirect branch misprediction.CVE-2022-40505qualcomm, inc.snapdragon+13EPSS score0.35%
Information disclosure due to buffer over-read in Modem while parsing DNS hostname.CVE-2022-40507qualcomm, inc.snapdragon+242EPSS score1.31%
Memory corruption due to double free in Core while mapping HLOS address to the list.CVE-2022-40521qualcomm, inc.snapdragon+242EPSS score0.35%
Transient DOS due to improper authorization in ModemCVE-2022-40532qualcomm, inc.snapdragon+353EPSS score0.12%
Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target.CVE-2022-22076qualcomm, inc.snapdragon+348EPSS score0.11%
information disclosure due to cryptographic issue in Core during RPMB read request.CVE-2022-33289qualcomm, inc.snapdragon+226EPSS score0.19%
Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card.CVE-2022-33287qualcomm, inc.snapdragon+39EPSS score0.35%
Information disclosure in Modem due to buffer over-read while getting length of Unfragmented headers in an IPv6 packet.CVE-2022-33302qualcomm, inc.snapdragon+225EPSS score0.12%
Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length.CVE-2022-33304qualcomm, inc.snapdragon+40EPSS score0.38%
Transient DOS due to NULL pointer dereference in Modem while performing pullup for received TCP/UDP packet.CVE-2022-33291qualcomm, inc.snapdragon+39EPSS score0.35%
Information disclosure in Modem due to buffer over-read while receiving a IP header with malformed length.CVE-2024-21465qualcomm, inc.snapdragon+257EPSS score0.10%
Memory corruption while processing key blob passed by the user.CVE-2024-21461qualcomm, inc.snapdragon+311EPSS score0.10%
Memory corruption while performing finish HMAC operation when context is freed by keymaster.CVE-2024-21469qualcomm, inc.snapdragon+222EPSS score0.10%
Memory corruption when an invoke call and a TEE call are bound for the same trusted application.CVE-2024-21462qualcomm, inc.snapdragon+309EPSS score0.09%
Transient DOS while loading the TA ELF file.