Qualcomm Sxr2330P vulnerabilities
118 vulnerabilities
Known vulnerabilities in Qualcomm Sxr2330P, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21479qualcomm, inc.snapdragon+74KEV
EPSS score0.84%
Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands.CVE-2025-21480qualcomm, inc.snapdragon+75KEVEPSS score0.46%
Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands.CVE-2025-21433qualcomm, inc.snapdragon+268EPSS score0.09%
Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.CVE-2025-21424qualcomm, inc.snapdragon+233EPSS score0.12%
Memory corruption while calling the NPU driver APIs concurrently.CVE-2025-21464qualcomm, inc.snapdragon+340EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21454qualcomm, inc.snapdragon+185EPSS score0.24%
Transient DOS while processing received beacon frame.CVE-2025-21486qualcomm, inc.snapdragon+31EPSS score0.10%
Memory corruption during dynamic process creation call when client is only passing address and length of shell binary.CVE-2025-21448qualcomm, inc.snapdragon+267EPSS score0.26%
Transient DOS may occur while parsing SSID in action frames.CVE-2025-21436qualcomm, inc.snapdragon+25EPSS score0.11%
Memory corruption may occur while initiating two IOCTL calls simultaneously to create processes from two different threads.CVE-2025-21468qualcomm, inc.snapdragon+146EPSS score0.11%
Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer.CVE-2025-21446qualcomm, inc.snapdragon+235EPSS score0.24%
Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests.CVE-2025-21476qualcomm, inc.snapdragon+42EPSS score0.09%
Memory corruption when passing parameters to the Trusted Virtual Machine during the handshake.CVE-2025-21432qualcomm, inc.snapdragon+239EPSS score0.09%
Memory corruption while retrieving the CBOR data from TA.CVE-2025-21481qualcomm, inc.snapdragon+249EPSS score0.07%
Memory corruption while performing private key encryption in trusted application.CVE-2025-21435qualcomm, inc.snapdragon+149EPSS score0.26%
Transient DOS may occur while parsing extended IE in beacon.CVE-2025-21459qualcomm, inc.snapdragon+123EPSS score0.34%
Transient DOS while parsing per STA profile in ML IE.CVE-2025-21485qualcomm, inc.snapdragon+29EPSS score0.08%
Memory corruption while processing INIT and multimode invoke IOCTL calls on FastRPC.CVE-2025-21482qualcomm, inc.snapdragon+287EPSS score0.09%
Cryptographic issue while performing RSA PKCS padding decoding.CVE-2025-21449qualcomm, inc.snapdragon+178EPSS score0.24%
Transient DOS may occur while processing malformed length field in SSID IEs.CVE-2025-21434qualcomm, inc.snapdragon+121EPSS score0.26%
Transient DOS may occur while parsing EHT operation IE or EHT capability IE.