Qualcomm Wsa8845 vulnerabilities

518 vulnerabilities

Known vulnerabilities in Qualcomm Wsa8845, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.

7.8CVE-2025-21467qualcomm, inc.snapdragon+103
EPSS score
0.11%
Memory corruption while reading the FW response from the shared queue.
8.6CVE-2025-21479qualcomm, inc.snapdragon+74KEV
EPSS score
0.84%
Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands.
7.8CVE-2025-21466qualcomm, inc.snapdragon+40
EPSS score
0.10%
Memory corruption while processing a private escape command in an event trigger.
8.2CVE-2025-21487qualcomm, inc.snapdragon+225
EPSS score
0.26%
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.
7.8CVE-2025-21447qualcomm, inc.snapdragon+8
EPSS score
0.11%
Memory corruption may occur while processing device IO control call for session control.
8.2CVE-2025-21484qualcomm, inc.snapdragon+173
EPSS score
0.26%
Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments from RTP packet.
7.5CVE-2025-21429qualcomm, inc.snapdragon+182
EPSS score
0.26%
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.
8.6CVE-2025-21480qualcomm, inc.snapdragon+75KEV
EPSS score
0.46%
Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands.
7.8CVE-2025-21440qualcomm, inc.snapdragon+49
EPSS score
0.11%
Memory corruption when IOCTL call is invoked from user-space to write board data to WLAN driver.
6.2CVE-2025-21433qualcomm, inc.snapdragon+268
EPSS score
0.09%
Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.
8.2CVE-2025-21427qualcomm, inc.snapdragon+172
EPSS score
0.24%
Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.
7.8CVE-2025-21424qualcomm, inc.snapdragon+233
EPSS score
0.12%
Memory corruption while calling the NPU driver APIs concurrently.
6.5CVE-2025-21464qualcomm, inc.snapdragon+340
EPSS score
0.09%
Information disclosure while reading data from an image using specified offset and size parameters.
9.1CVE-2025-21450qualcomm, inc.snapdragon+104
EPSS score
0.32%
Cryptographic issue occurs due to use of insecure connection method while downloading.
7.5CVE-2025-21430qualcomm, inc.snapdragon+223
EPSS score
0.26%
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.
7.8CVE-2025-21486qualcomm, inc.snapdragon+31
EPSS score
0.10%
Memory corruption during dynamic process creation call when client is only passing address and length of shell binary.
7.5CVE-2025-21448qualcomm, inc.snapdragon+267
EPSS score
0.26%
Transient DOS may occur while parsing SSID in action frames.
7.8CVE-2025-21436qualcomm, inc.snapdragon+25
EPSS score
0.11%
Memory corruption may occur while initiating two IOCTL calls simultaneously to create processes from two different threads.
7.8CVE-2025-21468qualcomm, inc.snapdragon+146
EPSS score
0.11%
Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer.
7.8CVE-2025-21461qualcomm, inc.snapdragon+24
EPSS score
0.09%
Memory corruption when programming registers through virtual CDM.