Qualcomm Wsa8845H vulnerabilities
515 vulnerabilities
Known vulnerabilities in Qualcomm Wsa8845H, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21467qualcomm, inc.snapdragon+103
EPSS score0.11%
Memory corruption while reading the FW response from the shared queue.CVE-2025-21479qualcomm, inc.snapdragon+74KEVEPSS score0.84%
Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands.CVE-2025-21466qualcomm, inc.snapdragon+40EPSS score0.10%
Memory corruption while processing a private escape command in an event trigger.CVE-2025-21487qualcomm, inc.snapdragon+225EPSS score0.26%
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.CVE-2025-21447qualcomm, inc.snapdragon+8EPSS score0.11%
Memory corruption may occur while processing device IO control call for session control.CVE-2025-21484qualcomm, inc.snapdragon+173EPSS score0.26%
Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments from RTP packet.CVE-2025-21429qualcomm, inc.snapdragon+182EPSS score0.26%
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.CVE-2025-21480qualcomm, inc.snapdragon+75KEVEPSS score0.46%
Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands.CVE-2025-21440qualcomm, inc.snapdragon+49EPSS score0.11%
Memory corruption when IOCTL call is invoked from user-space to write board data to WLAN driver.CVE-2025-21433qualcomm, inc.snapdragon+268EPSS score0.09%
Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.CVE-2025-21427qualcomm, inc.snapdragon+172EPSS score0.24%
Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.CVE-2025-21424qualcomm, inc.snapdragon+233EPSS score0.12%
Memory corruption while calling the NPU driver APIs concurrently.CVE-2025-21464qualcomm, inc.snapdragon+340EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21450qualcomm, inc.snapdragon+104EPSS score0.32%
Cryptographic issue occurs due to use of insecure connection method while downloading.CVE-2025-21430qualcomm, inc.snapdragon+223EPSS score0.26%
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.CVE-2025-21486qualcomm, inc.snapdragon+31EPSS score0.10%
Memory corruption during dynamic process creation call when client is only passing address and length of shell binary.CVE-2025-21448qualcomm, inc.snapdragon+267EPSS score0.26%
Transient DOS may occur while parsing SSID in action frames.CVE-2025-21436qualcomm, inc.snapdragon+25EPSS score0.11%
Memory corruption may occur while initiating two IOCTL calls simultaneously to create processes from two different threads.CVE-2025-21468qualcomm, inc.snapdragon+146EPSS score0.11%
Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer.CVE-2025-21461qualcomm, inc.snapdragon+24EPSS score0.09%
Memory corruption when programming registers through virtual CDM.