Ti vulnerabilities, page 2
28 vulnerabilities
Known vulnerabilities in Ti products, newest first, with CVSS severity, EPSS, KEV listings and ransomware use, across 33 products.
CVE-2022-25332texas instrumentsomap+1
EPSS score0.10%
The AES implementation in the Texas Instruments OMAP L138 (secure variants), present in mask ROM, suffers from a timing side channel which can be exploited by an adversary with non-secure supervisor privileges by managing cache contents and collecting timing information for different ciphertext inputs. Using this side channel, the SK_LOAD secure kernel routine can be used to recover the Customer Encryption Key (CEK).CVE-2022-25334texas instrumentsomap+1EPSS score0.20%
The Texas Instruments OMAP L138 (secure variants) trusted execution environment (TEE) lacks a bounds check on the signature size field in the SK_LOAD module loading routine, present in mask ROM. A module with a sufficiently large signature field causes a stack overflow, affecting secure kernel data pages. This can be leveraged to obtain arbitrary code execution in secure supervisor context by overwriting a SHA256 function pointer in the secure kernel data area when loading a forged, unsigned SK_LOAD module encrypted with the CEK (obtainable through CVE-2022-25332). This constitutes a full break of the TEE security architecture.CVE-2022-25333texas instrumentsomap+1EPSS score0.14%
The Texas Instruments OMAP L138 (secure variants) trusted execution environment (TEE) performs an RSA check implemented in mask ROM when loading a module through the SK_LOAD routine. However, only the module header authenticity is validated. An adversary can re-use any correctly signed header and append a forged payload, to be encrypted using the CEK (obtainable through CVE-2022-25332) in order to obtain arbitrary code execution in secure context. This constitutes a full break of the TEE security architecture.CVE-2024-41629tifusion_digital_power_designerEPSS score0.17%
An issue in Texas Instruments Fusion Digital Power Designer v.7.10.1 allows a local attacker to obtain sensitive information via the plaintext storage of credentialsCVE-2019-19193tible-stack+1EPSS score0.70%
The Bluetooth Low Energy peripheral implementation on Texas Instruments SIMPLELINK-CC2640R2-SDK through 3.30.00.20 and BLE-STACK through 1.5.0 before Q4 2019 for CC2640R2 and CC2540/1 devices does not properly restrict the advertisement connection request packet on reception, allowing attackers in radio range to cause a denial of service (crash) via a crafted packet.CVE-2019-17520ticc2640r2_software_development_kitEPSS score1.81%
The Bluetooth Low Energy implementation on Texas Instruments SDK through 3.30.00.20 for CC2640R2 devices does not properly restrict the SM Public Key packet on reception, allowing attackers in radio range to cause a denial of service (crash) via crafted packets.CVE-2019-15948ticc256xb-bt-sp_firmware+2EPSS score2.53%
Texas Instruments CC256x and WL18xx dual-mode Bluetooth controller devices, when LE scan mode is used, allow remote attackers to trigger a buffer overflow via a malformed Bluetooth Low Energy advertising packet, to cause a denial of service or potentially execute arbitrary code. This affects CC256xC-BT-SP 1.2, CC256xB-BT-SP 1.8, and WL18xx-BT-SP 4.4.CVE-2023-29468tiwilink8-wifi-mcp8EPSS score10.12%
The Texas Instruments (TI) WiLink WL18xx MCP driver does not limit the number of information elements (IEs) of type XCC_EXT_1_IE_ID or XCC_EXT_2_IE_ID that can be parsed in a management frame. Using a specially crafted frame, a buffer overflow can be triggered that can potentially lead to remote code execution. This affects WILINK8-WIFI-MCP8 version 8.5_SP3 and earlier.