CVE-2017-18157: qualcomm technologies, inc. snapdragon automobile, snapdragon mobile, snapdragon wear Use After Free
Vulnerability summary
CVE-2017-18157 is a high (CVSS 7.8) Use After Free vulnerability in qualcomm technologies, inc. snapdragon automobile, snapdragon mobile, snapdragon wear. EPSS estimates a 0.24% chance of exploitation in the next 30 days, higher than 14.6% of scored vulnerabilities.
Timeline
- 06-05-2019PublishedVulnerability first disclosed.
- 05-08-2024Last modifiedVulnerability information updated.
Description
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
CVSS metrics
2 scores · 1 source · 2 versionsEPSS trend
Probability
0.24%
Chance of exploitation in the next 30 days
Percentile
15%
Versus all other CVEs
30-day change
-0.02 pp
From 0.27% on 21-09-2026
Known exploited
Compare KEV catalogsNot in any of the 3 tracked catalogs.
Public exploits
0 foundNo public exploits indexed.
Weaknesses
CWE · root causeAffected systems
Qualcomm21 products
Qualcomm technologies, inc.1 product
- snapdragon automobile, snapdragon mobile, snapdragon wearMDM9206 | MDM9607 | MDM9650 | MSM8909W | MSM8996AU | SD 210/SD 212/SD 205 | SD 425 | SD 450 | SD 615/16/SD 415 | SD 625 | SD 650/52 | SD 820 | SD 820A | SD 835 | SD 845 | SDX20
2 vendors · 22 products