8.8

CVE-2017-18170: qualcomm, inc. snapdragon mobile Integer Underflow (Wrap or Wraparound)

CVSS: 8.8v3.0HighModified
Published 23-10-2018Last modified 05-08-2024
Open JSON

Vulnerability summary

CVE-2017-18170 is a high (CVSS 8.8) Integer Underflow (Wrap or Wraparound) vulnerability in qualcomm, inc. snapdragon mobile. EPSS estimates a 0.52% chance of exploitation in the next 30 days, higher than 43.5% of scored vulnerabilities.

Overall risk
35/100
0100
Medium · default modelHow is this calculated?
CVSS score
8.8/10
010
High · v3.0 (NVD)
EPSS score
0.52%
0%100%
Low · +0.17 pp in 30 days
KEVNot listedIn no KEV catalog
RansomwareNone recordedNo known use recorded
Public exploits0No public exploits recorded

Timeline

  1. 23-10-2018
    PublishedVulnerability first disclosed.
  2. 05-08-2024
    Last modifiedVulnerability information updated.

Description

Improper input validation in Bluetooth Controller function can lead to possible memory corruption in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016.

CVSS metrics

2 scores · 1 source · 2 versions

EPSS trend

Probability

0.52%

Chance of exploitation in the next 30 days

Percentile

44%

Versus all other CVEs

30-day change

+0.17 pp

From 0.36% on 21-09-2026

21-09-202621-10-2026
EPSS score
0.52%

Known exploited

Compare KEV catalogs

Not in any of the 3 tracked catalogs.

Public exploits

0 found

No public exploits indexed.

Weaknesses

CWE · root cause

Affected systems

Qualcomm25 products
Qualcomm, inc.1 product
  • snapdragon mobileQCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016

2 vendors · 26 products

References

2 links