CVE-2017-18172: qualcomm, inc. snapdragon automobile, snapdragon mobile Integer Overflow or Wraparound

Vulnerability summary

CVE-2017-18172 is a high (CVSS 7.8) Integer Overflow or Wraparound vulnerability in qualcomm, inc. snapdragon automobile, snapdragon mobile. EPSS estimates a 0.21% chance of exploitation in the next 30 days, higher than 10.5% of scored vulnerabilities.

Timeline

1. 23-10-2018
   PublishedVulnerability first disclosed.
2. 05-08-2024
   Last modifiedVulnerability information updated.

Description

In a device, with screen size 1440x2560, the check of contiguous buffer will overflow on certain buffer size resulting in an Integer Overflow or Wraparound in System UI in Snapdragon Automobile, Snapdragon Mobile in version MDM9635M, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.

• CWE-190Integer Overflow or WraparoundThe product performs a calculation that can produce an integer overflow or wraparound when the logic assumes that the resulting value will always be larger than the original value. This occurs when an integer value is incremented to a value that is too large to store in the associated representation. When this occurs, the value may become a very small or negative number.