CVE-2017-18173: qualcomm technologies, inc. snapdragon mobile Integer Overflow or Wraparound

Vulnerability summary

CVE-2017-18173 is a high (CVSS 7.8) Integer Overflow or Wraparound vulnerability in qualcomm technologies, inc. snapdragon mobile. EPSS estimates a 0.23% chance of exploitation in the next 30 days, higher than 12.6% of scored vulnerabilities.

Timeline

1. 06-05-2019
   PublishedVulnerability first disclosed.
2. 05-08-2024
   Last modifiedVulnerability information updated.

Description

In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.

• CWE-190Integer Overflow or WraparoundThe product performs a calculation that can produce an integer overflow or wraparound when the logic assumes that the resulting value will always be larger than the original value. This occurs when an integer value is incremented to a value that is too large to store in the associated representation. When this occurs, the value may become a very small or negative number.