CVE-2017-18278: qualcomm technologies, inc. snapdragon automobile, snapdragon mobile, snapdragon wear Integer Underflow (Wrap or Wraparound)

Vulnerability summary

CVE-2017-18278 is a high (CVSS 7.8) Integer Underflow (Wrap or Wraparound) vulnerability in qualcomm technologies, inc. snapdragon automobile, snapdragon mobile, snapdragon wear. EPSS estimates a 0.24% chance of exploitation in the next 30 days, higher than 14.4% of scored vulnerabilities.

Timeline

1. 06-05-2019
   PublishedVulnerability first disclosed.
2. 05-08-2024
   Last modifiedVulnerability information updated.

Description

An integer underflow may occur due to lack of check when received data length from font_mgr_qsee_request_service is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850.

• CWE-191Integer Underflow (Wrap or Wraparound)The product subtracts one value from another, such that the result is less than the minimum allowable integer value, which produces a value that is not equal to the correct result.