CVE-2018-11264: qualcomm, inc. snapdragon automobile, snapdragon mobile, snapdragon wear

Vulnerability summary

CVE-2018-11264 is a high (CVSS 7.8) vulnerability in qualcomm, inc. snapdragon automobile, snapdragon mobile, snapdragon wear. EPSS estimates a 0.24% chance of exploitation in the next 30 days, higher than 14.3% of scored vulnerabilities.

Timeline

1. 28-11-2018
   PublishedVulnerability first disclosed.
2. 05-08-2024
   Last modifiedVulnerability information updated.

Description

Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660.

• CWE-119Improper Restriction of Operations within the Bounds of a Memory BufferThe product performs operations on a memory buffer, but it reads from or writes to a memory location outside the buffer's intended boundary. This may result in read or write operations on unexpected memory locations that could be linked to other variables, data structures, or internal program data.