CVE-2018-11277: qualcomm, inc. snapdragon automobile, snapdragon mobile, snapdragon wear
Vulnerability summary
CVE-2018-11277 is a high (CVSS 7.8) vulnerability in qualcomm, inc. snapdragon automobile, snapdragon mobile, snapdragon wear. EPSS estimates a 0.17% chance of exploitation in the next 30 days, higher than 6% of scored vulnerabilities.
Timeline
- 20-09-2018PublishedVulnerability first disclosed.
- 05-08-2024Last modifiedVulnerability information updated.
Description
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
CVSS metrics
2 scores · 1 source · 2 versionsEPSS trend
Probability
0.17%
Chance of exploitation in the next 30 days
Percentile
6%
Versus all other CVEs
30-day change
0.00 pp
From 0.17% on 20-09-2026
Known exploited
Compare KEV catalogsNot in any of the 3 tracked catalogs.
Public exploits
0 foundNo public exploits indexed.
Weaknesses
CWE · root causeAffected systems
Qualcomm20 products
Qualcomm, inc.1 product
- snapdragon automobile, snapdragon mobile, snapdragon wearMSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660
2 vendors · 21 products