CVE-2018-11855: qualcomm, inc. snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon consumer electronics connectivity, snapdragon consumer iot, snapdragon industrial iot, snapdragon mobile Integer Overflow or Wraparound
Vulnerability summary
CVE-2018-11855 is a high (CVSS 7.8) Integer Overflow or Wraparound vulnerability in qualcomm, inc. snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon consumer electronics connectivity, snapdragon consumer iot, snapdragon industrial iot, snapdragon mobile. EPSS estimates a 0.21% chance of exploitation in the next 30 days, higher than 10.2% of scored vulnerabilities.
Timeline
- 11-02-2019PublishedVulnerability first disclosed.
- 05-08-2024Last modifiedVulnerability information updated.
Description
If an end user makes use of SCP11 sample OCE code without modification it could lead to a buffer overflow when transmitting a CAPDU in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT and Snapdragon Mobile in versions MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM630, SDM660.
CVSS metrics
2 scores · 1 source · 2 versionsEPSS trend
Probability
0.21%
Chance of exploitation in the next 30 days
Percentile
10%
Versus all other CVEs
30-day change
-0.01 pp
From 0.21% on 21-09-2026
Known exploited
Compare KEV catalogsNot in any of the 3 tracked catalogs.
Public exploits
0 foundNo public exploits indexed.
Weaknesses
CWE · root causeAffected systems
Qualcomm17 products
Qualcomm, inc.1 product
- snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon consumer electronics connectivity, snapdragon consumer iot, snapdragon industrial iot, snapdragon mobileMDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM630, SDM660
2 vendors · 18 products