CVE-2018-11865: qualcomm, inc. snapdragon mobile, snapdragon wear Integer Overflow or Wraparound
Vulnerability summary
CVE-2018-11865 is a high (CVSS 7.8) Integer Overflow or Wraparound vulnerability in qualcomm, inc. snapdragon mobile, snapdragon wear. EPSS estimates a 0.23% chance of exploitation in the next 30 days, higher than 13.4% of scored vulnerabilities.
Timeline
- 29-10-2018PublishedVulnerability first disclosed.
- 05-08-2024Last modifiedVulnerability information updated.
Description
Integer overflow may happen when calculating an internal structure size due to lack of validation of the input length in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016.
CVSS metrics
2 scores · 1 source · 2 versionsEPSS trend
Probability
0.23%
Chance of exploitation in the next 30 days
Percentile
13%
Versus all other CVEs
30-day change
0.00 pp
From 0.23% on 21-09-2026
Known exploited
Compare KEV catalogsNot in any of the 3 tracked catalogs.
Public exploits
0 foundNo public exploits indexed.
Weaknesses
CWE · root causeAffected systems
Qualcomm24 products
Qualcomm, inc.1 product
- snapdragon mobile, snapdragon wearMDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016
2 vendors · 25 products