CVE-2019-10597: qualcomm, inc. snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon consumer iot, snapdragon mobile, snapdragon wired infrastructure and networking Out-of-bounds Write
Vulnerability summary
CVE-2019-10597 is a high (CVSS 7.8) Out-of-bounds Write vulnerability in qualcomm, inc. snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon consumer iot, snapdragon mobile, snapdragon wired infrastructure and networking. EPSS estimates a 0.20% chance of exploitation in the next 30 days, higher than 9.7% of scored vulnerabilities.
Timeline
- 22-06-2020PublishedVulnerability first disclosed.
- 04-08-2024Last modifiedVulnerability information updated.
Description
kernel writes to user passed address without any checks can lead to arbitrary memory write in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in IPQ6018, IPQ8074, MSM8996, MSM8996AU, Nicobar, QCS605, Rennell, Saipan, SC7180, SC8180X, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
CVSS metrics
2 scores · 1 source · 2 versionsEPSS trend
Probability
0.20%
Chance of exploitation in the next 30 days
Percentile
10%
Versus all other CVEs
30-day change
0.00 pp
From 0.20% on 21-09-2026
Known exploited
Compare KEV catalogsNot in any of the 3 tracked catalogs.
Public exploits
0 foundNo public exploits indexed.
Weaknesses
CWE · root causeAffected systems
Qualcomm20 products
Qualcomm, inc.1 product
- snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon consumer iot, snapdragon mobile, snapdragon wired infrastructure and networkingIPQ6018, IPQ8074, MSM8996, MSM8996AU, Nicobar, QCS605, Rennell, Saipan, SC7180, SC8180X, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
2 vendors · 21 products
References
1 links- www.qualcomm.com/company/product-security/bulletins/june-2020-bulletinX Refsource CONFIRMBroken Link