CVE-2019-14037: qualcomm apq8009_firmware Use After Free
Vulnerability summary
CVE-2019-14037 is a high (CVSS 7.8) Use After Free vulnerability in qualcomm apq8009_firmware. EPSS estimates a 0.20% chance of exploitation in the next 30 days, higher than 9.1% of scored vulnerabilities.
Timeline
- 30-07-2020PublishedVulnerability first disclosed.
- 05-08-2024Last modifiedVulnerability information updated.
Description
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
CVSS metrics
2 scores · 1 source · 2 versionsEPSS trend
Probability
0.20%
Chance of exploitation in the next 30 days
Percentile
9%
Versus all other CVEs
30-day change
0.00 pp
From 0.20% on 21-09-2026
Known exploited
Compare KEV catalogsNot in any of the 3 tracked catalogs.
Public exploits
0 foundNo public exploits indexed.
Weaknesses
CWE · root causeAffected systems
Qualcomm31 products
1 vendor · 31 products
References
2 links- www.qualcomm.com/company/product-security/bulletins/july-2020-bulletinX Refsource CONFIRMBroken Link