CVE-2019-14083: qualcomm apq8009_firmware Integer Underflow (Wrap or Wraparound)
Vulnerability summary
CVE-2019-14083 is a high (CVSS 10.0) Integer Underflow (Wrap or Wraparound) vulnerability in qualcomm apq8009_firmware. EPSS estimates a 0.96% chance of exploitation in the next 30 days, higher than 61% of scored vulnerabilities.
Timeline
- 05-03-2020PublishedVulnerability first disclosed.
- 05-08-2024Last modifiedVulnerability information updated.
Description
While parsing Service Descriptor Extended Attribute received as part of SDF frame, there is a possibility that incorrect length is specified in the attribute length field of extended SSI which can lead to integer underflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, APQ8096, APQ8098, IPQ6018, IPQ8074, MSM8996AU, MSM8998, Nicobar, QCA6174A, QCA6390, QCA6574AU, QCA8081, QCA9377, QCA9379, QCN7605, QCS404, QCS405, QCS605, Rennell, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SM6150, SM7150, SM8150, SXR1130, SXR2130
CVSS metrics
2 scores · 1 source · 2 versionsEPSS trend
Probability
0.96%
Chance of exploitation in the next 30 days
Percentile
61%
Versus all other CVEs
30-day change
0.00 pp
From 0.96% on 21-09-2026
Known exploited
Compare KEV catalogsNot in any of the 3 tracked catalogs.
Public exploits
0 foundNo public exploits indexed.
Weaknesses
CWE · root causeAffected systems
Qualcomm37 products
1 vendor · 37 products
References
1 links- www.qualcomm.com/company/product-security/bulletins/march-2020-bulletinX Refsource CONFIRMVendor Advisory