CVE-2019-14085: qualcomm, inc. snapdragon auto, snapdragon compute, snapdragon consumer electronics connectivity, snapdragon consumer iot, snapdragon industrial iot, snapdragon mobile Integer Underflow (Wrap or Wraparound)

Vulnerability summary

CVE-2019-14085 is a high (CVSS 7.8) Integer Underflow (Wrap or Wraparound) vulnerability in qualcomm, inc. snapdragon auto, snapdragon compute, snapdragon consumer electronics connectivity, snapdragon consumer iot, snapdragon industrial iot, snapdragon mobile. EPSS estimates a 0.20% chance of exploitation in the next 30 days, higher than 9.6% of scored vulnerabilities.

Timeline

1. 05-03-2020
   PublishedVulnerability first disclosed.
2. 05-08-2024
   Last modifiedVulnerability information updated.

Description

Possible Integer underflow in WLAN function due to lack of check of data received from user side in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCN7605, QCS605, SDA845, SDM670, SDM710, SDM845, SDM850, SM8150, SXR1130

• CWE-191Integer Underflow (Wrap or Wraparound)The product subtracts one value from another, such that the result is less than the minimum allowable integer value, which produces a value that is not equal to the correct result.