CVE-2019-2244: qualcomm, inc. snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon consumer iot, snapdragon industrial iot, snapdragon iot, snapdragon mobile, snapdragon wearable Integer Underflow (Wrap or Wraparound)

Vulnerability summary

CVE-2019-2244 is a high (CVSS 10.0) Integer Underflow (Wrap or Wraparound) vulnerability in qualcomm, inc. snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon consumer iot, snapdragon industrial iot, snapdragon iot, snapdragon mobile, snapdragon wearable. EPSS estimates a 0.99% chance of exploitation in the next 30 days, higher than 62% of scored vulnerabilities.

Timeline

1. 24-05-2019
   PublishedVulnerability first disclosed.
2. 04-08-2024
   Last modifiedVulnerability information updated.

Description

Possible integer underflow can happen when calculating length of elementary stream info from invalid section length which is later used to read from input buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearable in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016

• CWE-191Integer Underflow (Wrap or Wraparound)The product subtracts one value from another, such that the result is less than the minimum allowable integer value, which produces a value that is not equal to the correct result.