CVE-2020-11208: qualcomm, inc. snapdragon auto, snapdragon consumer iot, snapdragon mobile Integer Underflow (Wrap or Wraparound)
Vulnerability summary
CVE-2020-11208 is a high (CVSS 7.8) Integer Underflow (Wrap or Wraparound) vulnerability in qualcomm, inc. snapdragon auto, snapdragon consumer iot, snapdragon mobile. EPSS estimates a 1.73% chance of exploitation in the next 30 days, higher than 77.3% of scored vulnerabilities. 1 public exploit is recorded.
Timeline
- 12-11-2020PublishedVulnerability first disclosed.
- 04-08-2024Last modifiedVulnerability information updated.
Description
Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439
CVSS metrics
2 scores · 1 source · 2 versionsEPSS trend
Probability
1.73%
Chance of exploitation in the next 30 days
Percentile
77%
Versus all other CVEs
30-day change
0.00 pp
From 1.73% on 21-09-2026
Known exploited
Compare KEV catalogsNot in any of the 3 tracked catalogs.
Public exploits
1 foundExploit Reference (research.checkpoint.com)
Maturity: unknown
Weaknesses
CWE · root causeAffected systems
Qualcomm13 products
Qualcomm, inc.1 product
- snapdragon auto, snapdragon consumer iot, snapdragon mobileSD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439
2 vendors · 14 products
References
3 links- www.qualcomm.com/company/product-security/bulletins/november-2020-bulletinX Refsource CONFIRMVendor Advisory