CVE-2020-3675: qualcomm ipq5018_firmware Integer Underflow (Wrap or Wraparound)
Vulnerability summary
CVE-2020-3675 is a high (CVSS 10.0) Integer Underflow (Wrap or Wraparound) vulnerability in qualcomm ipq5018_firmware. EPSS estimates a 1.07% chance of exploitation in the next 30 days, higher than 64.4% of scored vulnerabilities.
Timeline
- 08-09-2020PublishedVulnerability first disclosed.
- 04-08-2024Last modifiedVulnerability information updated.
Description
u'Potential integer underflow while parsing Service Info and IPv6 link-local TLVs that comes as part of NDPE attribute' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in IPQ5018, IPQ6018, IPQ8074, Kamorta, Nicobar, QCA6390, QCN7605, QCS404, QCS405, Rennell, SA415M, Saipan, SC7180, SC8180X, SDX55, SM6150, SM7150, SM8150, SM8250
CVSS metrics
2 scores · 1 source · 2 versionsEPSS trend
Probability
1.07%
Chance of exploitation in the next 30 days
Percentile
64%
Versus all other CVEs
30-day change
0.00 pp
From 1.07% on 21-09-2026
Known exploited
Compare KEV catalogsNot in any of the 3 tracked catalogs.
Public exploits
0 foundNo public exploits indexed.
Weaknesses
CWE · root causeAffected systems
Qualcomm19 products
1 vendor · 19 products
References
1 links- www.qualcomm.com/company/product-security/bulletins/august-2020-bulletinX Refsource CONFIRMBroken LinkVendor Advisory