8.4

CVE-2022-22089: qualcomm, inc. snapdragon connectivity, snapdragon mobile, snapdragon wearables Integer Overflow or Wraparound

CVSS: 8.4v3.1HighModified
Published 16-09-2022Last modified 03-08-2024

Vulnerability summary

CVE-2022-22089 is a high (CVSS 8.4) Integer Overflow or Wraparound vulnerability in qualcomm, inc. snapdragon connectivity, snapdragon mobile, snapdragon wearables. EPSS estimates a 0.12% chance of exploitation in the next 30 days, higher than 1.9% of scored vulnerabilities.

Overall risk
34/100
0100
Medium · default modelHow is this calculated?
CVSS score
8.4/10
010
High · v3.1 (CVE.org)
EPSS score
0.12%
0%100%
Low · 0.00 pp in 30 days
KEVNot listedIn no KEV catalog
RansomwareNone recordedNo known use recorded
Public exploits0No public exploits recorded

Timeline

  1. 16-09-2022
    PublishedVulnerability first disclosed.
  2. 03-08-2024
    Last modifiedVulnerability information updated.

Description

Memory corruption in audio while playing record due to improper list handling in two threads in Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables

CVSS metrics

2 scores · 2 sources · 1 version

EPSS trend

Probability

0.12%

Chance of exploitation in the next 30 days

Percentile

2%

Versus all other CVEs

30-day change

0.00 pp

From 0.12% on 21-09-2026

21-09-202621-10-2026
EPSS score
0.12%

Known exploited

Compare KEV catalogs

Not in any of the 3 tracked catalogs.

Public exploits

0 found

No public exploits indexed.

Weaknesses

CWE · root cause

Affected systems

Qualcomm23 products
Qualcomm, inc.1 product

2 vendors · 24 products

References

1 links