8.4

CVE-2022-25697: qualcomm, inc. snapdragon mobile, snapdragon wearables Out-of-bounds Write

CVSS: 8.4v3.1HighModified
Published 13-12-2022Last modified 22-04-2025
Open JSON

Vulnerability summary

CVE-2022-25697 is a high (CVSS 8.4) Out-of-bounds Write vulnerability in qualcomm, inc. snapdragon mobile, snapdragon wearables. EPSS estimates a 0.13% chance of exploitation in the next 30 days, higher than 2.1% of scored vulnerabilities.

Overall risk
34/100
0100
Medium · default modelHow is this calculated?
CVSS score
8.4/10
010
High · v3.1 (CVE.org)
EPSS score
0.13%
0%100%
Low · 0.00 pp in 30 days
KEVNot listedIn no KEV catalog
RansomwareNone recordedNo known use recorded
Public exploits0No public exploits recorded

Timeline

  1. 13-12-2022
    PublishedVulnerability first disclosed.
  2. 22-04-2025
    Last modifiedVulnerability information updated.

Description

Memory corruption in i2c buses due to improper input validation while reading address configuration from i2c driver in Snapdragon Mobile, Snapdragon Wearables

CVSS metrics

2 scores · 2 sources · 1 version

EPSS trend

Probability

0.13%

Chance of exploitation in the next 30 days

Percentile

2%

Versus all other CVEs

30-day change

0.00 pp

From 0.12% on 21-09-2026

21-09-202621-10-2026
EPSS score
0.13%

Known exploited

Compare KEV catalogs

Not in any of the 3 tracked catalogs.

Public exploits

0 found

No public exploits indexed.

Weaknesses

CWE · root cause

Affected systems

Qualcomm16 products
Qualcomm, inc.1 product
  • snapdragon mobile, snapdragon wearablesSD 8 Gen1 5G | SD429 | SDA429W | SDM429W | WCD9380 | WCN3610 | WCN3620 | WCN3660B | WCN3680B | WCN3980 | WCN6855 | WCN6856 | WCN7850 | WCN7851 | WSA8830 | WSA8835

2 vendors · 17 products

References

1 links