Qualcomm Sm8350 Ac vulnerabilities, page 2
74 vulnerabilities
Known vulnerabilities in Qualcomm Sm8350 Ac, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2022-33307qualcomm, inc.snapdragon+110
EPSS score0.12%
Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed.CVE-2022-33289qualcomm, inc.snapdragon+226EPSS score0.19%
Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card.CVE-2022-33224qualcomm, inc.snapdragon+46EPSS score0.11%
Memory corruption in core due to buffer copy without check9ing the size of input while processing ioctl queries.CVE-2022-33302qualcomm, inc.snapdragon+225EPSS score0.12%
Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length.CVE-2022-33251qualcomm, inc.snapdragon+74EPSS score0.38%
Transient DOS due to reachable assertion in Modem because of invalid network configuration.CVE-2022-33270qualcomm, inc.snapdragon+42EPSS score0.28%
Transient DOS due to time-of-check time-of-use race condition in Modem while processing RRC Reconfiguration message.CVE-2022-33273qualcomm, inc.snapdragon+99EPSS score0.12%
Information disclosure due to buffer over-read in Trusted Execution Environment while QRKS report generation.CVE-2022-33303qualcomm, inc.snapdragon+21EPSS score0.10%
Transient DOS due to uncontrolled resource consumption in Linux kernel when malformed messages are sent from the Gunyah Resource Manager message queue.CVE-2022-33231qualcomm, inc.snapdragon+219EPSS score0.08%
Memory corruption due to double free in core while initializing the encryption key.CVE-2024-21465qualcomm, inc.snapdragon+257EPSS score0.10%
Memory corruption while processing key blob passed by the user.CVE-2024-21461qualcomm, inc.snapdragon+311EPSS score0.10%
Memory corruption while performing finish HMAC operation when context is freed by keymaster.CVE-2024-21469qualcomm, inc.snapdragon+222EPSS score0.10%
Memory corruption when an invoke call and a TEE call are bound for the same trusted application.CVE-2024-21462qualcomm, inc.snapdragon+309EPSS score0.09%
Transient DOS while loading the TA ELF file.CVE-2024-23368qualcomm, inc.snapdragon+341EPSS score0.10%
Memory corruption when allocating and accessing an entry in an SMEM partition.CVE-2024-23372qualcomm, inc.snapdragon+109EPSS score0.13%
Memory corruption while invoking IOCTL call for GPU memory allocation and size param is greater than expected size.CVE-2024-23373qualcomm, inc.snapdragon+220EPSS score0.15%
Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released.CVE-2023-21658qualcomm, inc.snapdragon+151EPSS score0.38%
Transient DOS in WLAN Firmware while processing the received beacon or probe response frame.CVE-2023-21673qualcomm, inc.snapdragon+161EPSS score0.10%
Improper Access to the VM resource manager can lead to Memory Corruption.CVE-2023-21630qualcomm, inc.snapdragon+42EPSS score0.12%
Memory Corruption in Multimedia Framework due to integer overflow when synx bind is called along with synx signal.CVE-2023-21657qualcomm, inc.snapdragon+126EPSS score0.12%
Memoru corruption in Audio when ADSP sends input during record use case.